Patents by Inventor Burkhard Markmann

Burkhard Markmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170206882
    Abstract: There is provided a method of producing acoustic damping elements having an acoustic resistance. For that purpose at least one sleeve with a hole having a diameter is placed below a base material. At least one hole is stamped in the base material by at least one punch having a punch diameter. The punching operation is repeated at various positions on the base material.
    Type: Application
    Filed: July 24, 2015
    Publication date: July 20, 2017
    Applicant: Sennheiser electronic GmbH & Co. KG
    Inventors: Benjamin ROSS, Robert KONETZKY, Burkhard MARKMANN
  • Patent number: 8731231
    Abstract: There is provided a dynamic sound transducer having a diaphragm system (10) which has at least a first and second metallized surface (11) which are separated from each other by an insulating surface (12). The dynamic sound transducer further has a moving coil (20) with a coil wire (25). An end of the coil wire is electrically conductingly connected to the first metallized surface (11) and the other end of the coil wire is electrically conductingly connected to the second metallized surface (11).
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: May 20, 2014
    Assignee: Sennheiser electronic GmbH & Co. KG
    Inventors: Till Teske-Fischer, Markus Kuhr, Vladimir Gorelik, Dirk Hackbarth, Heinz Epping, Burkhard Markmann, Axel Grell, Andre Michaelis
  • Publication number: 20100183173
    Abstract: There is provided a dynamic sound transducer having a diaphragm system (10) which has at least a first and second metallized surface (11) which are separated from each other by an insulating surface (12). The dynamic sound transducer further has a moving coil (20) with a coil wire (25). An end of the coil wire is electrically conductingly connected to the first metallized surface (11) and the other end of the coil wire is electrically conductingly connected to the second metallized surface (11).
    Type: Application
    Filed: January 30, 2008
    Publication date: July 22, 2010
    Applicant: Sennheiser Electronic GmbH & KG
    Inventors: Till Teske-Fischer, Markus Kuhr, Vladimir Gorelik, Dirk Hackbarth, Heinz Epping, Burkhard Markmann, Axel Grell, Andre Michaelis
  • Patent number: 5949897
    Abstract: A sound reproduction device such as a headphone with active noise compensation has a housing and a transducer for converting electrical signals to sound waves is disposed within the housing. The transducer has a diaphragm for separating the volume (V.sub.2) in front of the diaphragm from the volume (V.sub.1) to the rear of the diaphragm. The transducer diaphragm and rear volume (V.sub.1) have a determined compliance. The sound reproduction device includes active noise compensation components for reducing unwanted noise at the output of the transducer. The diaphragm has a compliance (N.sub.M) which is less than the compliance (N.sub.1) of the rear volume (V.sub.1). The diaphragm is preferably constructed from a plurality of layers. In a further preferred arrangement, a damping element is disposed very close to the rear side of the diaphragm. A preferred construction for optimizing the voice coil is described.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: September 7, 1999
    Assignee: Sennheiser electronic KG
    Inventors: Volker Bartels, Burkhard Markmann
  • Patent number: 5809156
    Abstract: A sound reproduction device such as a headphone with active noise compensation has a housing and a transducer for converting electrical signals to sound waves is disposed within the housing. The transducer has a diaphragm for separating the volume (V.sub.2) in front of the diaphragm from the volume (V.sub.1) to the rear of the diaphragm. The transducer diaphragm and rear volume (V.sub.1) have a determined compliance. The sound reproduction device includes active noise compensation components for reducing unwanted noise at the output of the transducer. The diaphragm has a compliance (N.sub.M) which is less than the compliance (N.sub.1) of the rear volume (V.sub.1). The diaphragm is preferably constructed from a plurality of layers. In a further preferred arrangement, a damping element is disposed very close to the rear side of the diaphragm. A preferred construction for optimizing the voice coil is described.
    Type: Grant
    Filed: November 20, 1995
    Date of Patent: September 15, 1998
    Assignee: Sennheiser electronic KG
    Inventors: Volker Bartels, Burkhard Markmann