Abstract: A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.

Abstract: A multipiece susceptor assembly that includes a generally flat polyhedron shaped top and bottom defining a plurality of facets on which panels are secured for supporting wafers to be processed. Various embodiments are disclosed including a top plate that receives a slide. The polyhedron shape portion further includes a multifaced side which includes an open side face that receives a single face mounted on the slide. A bottom plate is provided that fits within the bottom frame. The single side face structure to mount on the slide and the bottom frame prevents displacement of the slide and holds the slide against the frame during rotation of the susceptor. In another embodiment each individual panel is secured to the top plate by a hanger on the panel inserted in a cavity on the top plate while the panel is secured to the bottom plate in a locking relation by a notch in the panel interfitting with a triangular tab extending outward from the bottom plate.

Abstract: A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.