Patents by Inventor Burt Barber

Burt Barber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices and methods of manufacturing semiconductor devices
    Patent number: 11908755
    Abstract: In one example, a semiconductor device comprises a substrate comprising a top side, a bottom side, and a conductive structure, a body over the top side of the substrate, an electronic component over the top side of the substrate and adjacent to the body, wherein the electronic component comprises an interface element on a top side of the electronic component, a lid over the interface element and a seal between the top side of the electronic component and the lid, and a buffer on the top side of the substrate between the electronic component and the body. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: February 20, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Sang Jae Jang, Weilung Lu, Burt Barber, Adrian Arcedera, Shingo Nakamura
  • SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
    Publication number: 20210265225
    Abstract: In one example, a semiconductor device comprises a substrate comprising a top side, a bottom side, and a conductive structure, a body over the top side of the substrate, an electronic component over the top side of the substrate and adjacent to the body, wherein the electronic component comprises an interface element on a top side of the electronic component, a lid over the interface element and a seal between the top side of the electronic component and the lid, and a buffer on the top side of the substrate between the electronic component and the body. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 26, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Sang Jae Jang, Weilung Lu, Burt Barber, Adrian Arcedera, Shingo Nakamura