Abstract: A technique for filling hollow, plated-through-hole vias in multi-layer printed circuit substrates with solder and then joining the solder filled via with a solder ball on a solder ball connectable electronic module is disclosed. The filling of the vias is accomplished by depositing solder paste on one end of the hollow via and reflowing the solder particles within the solder paste to at least partially fill the PTH via. The depositing of the solder paste and the reflowing operations may be repeated until such time as the via is substantially completely filled with solid solder. The importance of the prefilling of the vias with solder is that the reflowing operation of solder balls or solder paste when joining the multi-layer printed circuit board to the electronic module, will prevent undue wicking or pulling of molten solder from the electrical connection into the PTH via, thereby preventing the formation of solder starved or unreliable electrical connections.