Abstract: An environmental testing chamber (10) and thermal cycling method in which, in addition to stressing the device (20) under test with electrical bias (32), elevated temperature (12), pressure (16), and humidity (18) while the device is being monitored (32), a thermoelectric heat pump (26) quickly cycles the temperature of the device by pumping heat from the heat sink (22) mounting the device to another larger heat sink (24).

Abstract: In order to suppress electrostatic charge buildup at a workplace, a wire having needle(s) connected thereto and extending vertically downward therefrom is suspended horizontally over the workplace, and a sequence of electrical pulses of alternating polarity is applied to the wire, each of the pulses having a pulse-width of the order of 1 second and a pulse-height of approximately 15 kilovolts.

Abstract: A method of fabricating a thin film semiconductor hybrid circuit is disclosed. After processing of the integrated circuit in the semiconductor wafer up to the point of establishing ohmic contacts (14) to devices (13), a thin film RC circuit is fabricated on an insulating layer (11,12) overlying the wafer. This is accomplished by first forming the capacitor anodes (15') on the insulator by depositing and etching a layer such as alpha tantalum. Resistors (16) are then formed by depositing and etching a layer such as tantalum nitride. Portions of the capacitor anodes are then anodized using an appropriate mask (17) to form the capacitor dielectric. Capacitor counterelectrodes (20') and interconnect conductors (20'") are formed by depositing and etching successive layers of metal such as nickel-chromium and gold. After all thin film components are formed, the resistors and capacitors are stabilized by heating the circuit in an atmosphere comprising high pressure steam.

Abstract: A moisture sensing unit (30, FIG. 1 or 58, FIG. 4) is included within a hermetically sealed package. A localized external portion of the package in close proximity to the unit is cooled while the temperature and the alternating-current capacitance and/or conductance characteristic of the unit are measured. The measured characteristic exhibits a sharp increase at the temperature corresponding to the dew point of the atmosphere within the package. In turn, the dew point temperature is a direct indicator of the moisture content of the package.