Abstract: Embodiments of packaged semiconductor devices and lead frames for such devices are provided, such as a lead frame including: a row of lead fingers, wherein an outer end of each lead finger is connected to a leaded side of the lead frame; a package body perimeter that indicates placement of a package body of the packaged semiconductor device, wherein an inner end of each lead finger falls within the package body perimeter; a retention tab that protrudes from an interior edge of a non-leaded side of the lead frame, wherein the retention tab falls outside of the package body perimeter; and a non-conductive tie bar structure attached to the retention tab, wherein the non-conductive tie bar structure falls within the package body perimeter.

Abstract: A packaged lead frame includes a encapsulant having a first minor side, a second minor side opposite the first minor side, a third minor side, and a fourth minor side opposite the third minor side, and a plurality of leads along the third minor side between the first minor side and a center plane between the first and second minor side. The plurality of leads extend outwardly from the encapsulant at a first plane. Each of the plurality of leads includes a corresponding jog external to the encapsulant which jogs away from the center plane, wherein the corresponding jog of each lead from a first lead of the plurality of leads closest to the center plane to a last lead of the first plurality of leads closest to the first minor side jogs incrementally further away the center plane.