Abstract: A micro-fluid ejection head has a resistor layer defining a heater element. An insulative layer underlies the heater element and a capping layer on the insulative layer substantially prevents ion mobility between the resistor and insulative layers. Resistance stability of the heater has been shown improved as has adhesion of the heater to the insulator. Representative layers include insulation of methyl silesquioxane (MSQ) in a thickness of about 5000 Angstroms or more, while the cap is a silicon nitride in a thickness of about 2000 Angstroms or less. Other capping layers include silicon carbide, silicon oxide or dielectrics. The resistor layer typifies TaAIN in a thickness of about 350 Angstroms, including overlying anode and cathode conductors that define the heater. Coating layers are also disclosed as are thermal barrier layers.

Abstract: A method for forming an ink jetting device includes providing a silicon chip including a silicon substrate having a first surface and a second surface opposite to the first surface, the first surface having formed thereon a plurality of electrical heater elements and a silicon oxide ink ejection chamber layer configured to define a plurality of ink ejection chambers; providing a silicon nozzle plate having a silicon nozzle layer having a third surface and a fourth surface opposite to the third surface, the fourth surface having formed thereon a silicon oxide layer; aligning the silicon nozzle plate with the silicon chip; fusion bonding the silicon oxide layer of the silicon nozzle plate to the silicon oxide ink ejection chamber layer of the silicon chip; and forming a plurality of nozzle holes through the silicon nozzle plate respectively located over the plurality of electrical heater elements.

Abstract: The present disclosure is directed to a micro-fluid ejection head for a micro-fluid ejection device. The head includes a semiconductor substrate, a fluid ejection actuator supported by the semiconductor substrate, a nozzle member containing nozzle holes attached to the substrate for expelling droplets of fluid from one or more nozzle holes in the nozzle member upon activation of the ejection actuator. The substrate further includes a thermal insulating barrier layer between the semiconductor substrate and the fluid ejection actuator. The thermal insulating barrier layer includes a porous, substantially impermeable material having a thermal conductivity of less than about 1 W/m-K.