Abstract: In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the joining material. The BGCS is at least partially removed from the substrate.

Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.

Abstract: In accordance with particular embodiments, a method for packaging an incident radiation detector includes depositing an opaque solder resistant material on a first surface of a transparent lid substrate configured to cover at least one detector. The method also includes forming at least one cavity in the lid substrate. The method further includes forming a first portion of at least one hermetic seal ring on the opaque solder resistant material. The first portion of each hermetic seal ring surrounds a perimeter of a corresponding cavity in the lid substrate. The method also includes aligning the first portion of the at least one hermetic seal ring with a second portion of the at least one hermetic seal ring. The method additionally includes bonding the first portion of the at least one hermetic seal ring with the second portion of the at least one hermetic seal ring with solder.

Abstract: In accordance with particular embodiments, a method for packaging electronic devices includes melting solder for a solder jet. The method additionally includes depositing the melted solder from the solder jet in a pattern on a first substrate of a first component of an electronic device. The pattern comprises a plurality of individual dots of melted solder. The method also includes aligning a second substrate of a second component of the electronic device with the pattern deposited on the first substrate of the electronic device. The method further includes re-melting the solder deposited in the pattern on the first substrate. The method additionally includes, while the solder is re-melting, compressing the first and second substrates.

Abstract: A method for singulating a substrate such as a semiconductor wafer populated with a plurality of MEMS devices. A preferred embodiment of the present invention comprises mounting a glass cover onto the wafer, then orienting the wafer and removably mounting it on an adhesive tape. A partial cut or series of partial cuts is then made through the cover to facilitate the later removal of selected cover portions using an automated process. The dice are then separated using a series of full cuts made perpendicular and parallel to the partial cuts and the selected cover portions removed from each die. The separated dice are then packaged for use or for further fabrication.