Abstract: The present invention relates to an optical assembly, a backlight unit, and a display apparatus thereof. According to an embodiment of the present invention, an optical assembly includes a first layer, a plurality of light sources disposed over the first layer, a second layer that is disposed above the first layer and covering the plurality of light sources, and at least one reflection layer between the first layer and the second layer, wherein the reflection layer includes at least a first portion and a second portion having different reflectances.

Abstract: In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.

Abstract: The present invention relates to an optical assembly, a backlight unit, and a display apparatus thereof. According to an embodiment of the present invention, an optical assembly includes a first layer, a plurality of light sources disposed over the first layer, a second layer that is disposed above the first layer and covering the plurality of light sources, and a pattern layer disposed above or in the second layer, wherein the pattern layer includes a plurality of patterns disposed at positions substantially corresponding to the light sources.

Abstract: The present invention relates to an optical assembly, a backlight unit, and a display apparatus thereof. According to an embodiment of the present invention, an optical assembly includes a first layer; a plurality of light sources disposed over the first layer; and a second layer that is disposed above the first layer and cover the plurality of light sources on the first layer, wherein the plurality of light sources are disposed as a first light source array and a second light source array, the first light source array including first lines of light sources among the plurality of light sources, the second light source array including second lines of light sources among the plurality of light sources, the first and second lines being alternatively disposed.

Abstract: A light emitting diode package may be provided that includes a light emitting diode chip and a heat sink. Heat generated from the light emitting diode chip may be radiated to the outside using the heat sink.

Abstract: The present invention relates to an optical assembly, a backlight unit, and a display apparatus thereof. According to an embodiment of the present invention, an optical assembly includes a first layer; a plurality of light sources disposed over the first layer; and a second layer that is disposed above the first layer and cover the plurality of light sources on the first layer, wherein the plurality of light sources are disposed as a first light source array and a second light source array, the first light source array including first lines of light sources among the plurality of light sources, the second light source array including second lines of light sources among the plurality of light sources, the first and second lines being alternatively disposed.

Abstract: The present invention relates to an optical assembly, a backlight unit, and a display apparatus thereof. According to an embodiment of the present invention, an optical assembly includes a first layer, a plurality of light sources disposed over the first layer, a second layer that is disposed above the first layer and covering the plurality of light sources, and at least one reflection layer between the first layer and the second layer, wherein the reflection layer includes at least a first portion and a second portion having different reflectances.

Abstract: The present invention relates to an optical assembly, a backlight unit, and a display apparatus thereof. According to an embodiment of the present invention, an optical assembly includes a first layer, a plurality of light sources disposed over the first layer, a second layer that is disposed above the first layer and covering the plurality of light sources, and a pattern layer disposed above or in the second layer, wherein the pattern layer includes a plurality of patterns disposed at positions substantially corresponding to the light sources.

Abstract: A light emitting diode package may be provided that includes a light emitting diode chip and a heat sink. Heat generated from the light emitting diode chip may be radiated to the outside using the heat sink.

Abstract: In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.

Abstract: A circuit board for a light emitting device and a light emitting unit using the same, which are capable of achieving an enhancement in light emission efficiency and an enhancement in reliability, are disclosed. The disclosed circuit board includes a substrate having a first surface and a second surface, at least one pair of conductive lines formed on the first surface of the substrate, and electrically connected to a light emitting device package, and a heat transfer member formed in a region where the light emitting device package is coupled to the circuit board, such that the heat transfer member connects the first and second surfaces of the substrate.

Abstract: A printed circuit broad capable of improving reliability, a light emitting apparatus having the same and a manufacturing method thereof are disclosed. The printed circuit board mounted with a light emitting device package includes a first metal layer, an insulating layer disposed on the first metal layer, a second metal layer disposed on the insulating layer, and a mounting groove for mounting the light emitting device package, which has a depth reaching at least an upper surface of the first metal layer.

Abstract: The present invention relates to an optical assembly, a backlight unit, and a display apparatus thereof. According to an embodiment of the present invention, an optical assembly includes a first layer, a plurality of light sources disposed over the first layer, a second layer that is disposed above the first layer and covering the plurality of light sources, and a pattern layer disposed above or in the second layer, wherein the pattern layer includes a plurality of patterns disposed at positions substantially corresponding to the light sources.