Patents by Inventor Buz Darabnia

Buz Darabnia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermocouple
    Patent number: 8616765
    Abstract: A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: December 31, 2013
    Assignee: ASM America, Inc.
    Inventors: Buz Darabnia, Andy Yednak, Mike Halpin, Loren Jacobs, Ravinder Aggarwal
  • THERMOCOUPLE
    Publication number: 20120310440
    Abstract: A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
    Type: Application
    Filed: July 31, 2012
    Publication date: December 6, 2012
    Applicant: ASM AMERICA, INC.
    Inventors: Buz Darabnia, Andy Yednak, Mike Halpin, Loren Jacobs, Ravinder Aggarwal
  • Thermocouple
    Patent number: 8262287
    Abstract: A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: September 11, 2012
    Assignee: ASM America, Inc.
    Inventors: Buz Darabnia, Andy Yednak, Mike Halpin, Loren Jacobs, Ravinder Aggarwal
  • THERMOCOUPLE
    Publication number: 20100145547
    Abstract: A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
    Type: Application
    Filed: December 8, 2008
    Publication date: June 10, 2010
    Applicant: ASM AMERICA, INC.
    Inventors: Buz Darabnia, Andy Yednak, Mike Halpin, Loren Jacobs, Ravinder Aggarwal