Patents by Inventor BY Merchants National Bank of Allentown, executor

BY Merchants National Bank of Allentown, executor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conduction system for thin film and hybrid integrated circuits
    Patent number: 4109297
    Abstract: A metallization scheme for interconnection of elements in thin film and hybrid circuits is described. A thin layer of titanium is first formed, preferably by evaporation or sputtering, on the surface of the insulating substrate. A thin layer of copper is then formed in the same manner over the titanium layer. This is followed by electroplating of copper to a desired thickness onto selected portions of the Ti-Cu multilayer. Successive layers of nickel and gold are then selectively electroplated onto the plated copper regions. An additional layer of palladium may also be included between the titanium and copper layers for improved adhesion. The Ti-Cu-Ni-Au metallization system has been found unusually compatible with the major processing requirements of thin film circuits, for example, thermocompression bonding, soldering, via-hole coverage and resistor stabilization.
    Type: Grant
    Filed: March 25, 1977
    Date of Patent: August 22, 1978
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Nathan George Lesh, deceased, BY Merchants National Bank of Allentown, executor, Joseph Michael Morabito, John Henry Thomas, III
  • Conduction system for thin film and hybrid integrated circuits
    Patent number: 4016050
    Abstract: A metallization scheme for interconnection of elements in thin film and hybrid circuits is described. A thin layer of titanium is first formed, preferably by evaporation or sputtering, on the surface of the insulating substrate. A thin layer of copper is then formed in the same manner over the titanium layer. This is followed by electroplating of copper to a desired thickness onto selected portions of the Ti-Cu multilayer. Successive layers of nickel and gold are then selectively electroplated onto the plated copper regions. An additional layer of palladium may also be included between the titanium and copper layers for improved adhesion. The Ti-Cu-Ni-Au metallization system has been found unusually compatible with the major processing requirements of thin film circuits, for example, thermocompression bonding, soldering, via-hole coverage and resistor stabilization.
    Type: Grant
    Filed: May 12, 1975
    Date of Patent: April 5, 1977
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Nathan George Lesh, deceased, BY Merchants National Bank of Allentown, executor, Joseph Michael Morabito, John Henry Thomas, III