Patents by Inventor Byeong Chan SONG

Byeong Chan SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE
    Publication number: 20240174898
    Abstract: The present invention relates to a functional pressure-sensitive composition having high heat resistance and bending resistance characteristics, including: 40 to 55 wt % of a urethane acrylate oligomer, 30 to 44 wt % of an acrylate monomer, 2 to 5 wt % of a photoinitiator, 0.2 to 2 wt % of a silane coupling agent, 0.1 to 1 wt % of a light stabilizer, 0.1 to 1 wt % of an ultraviolet absorber and 0.1 to 1 wt % of an antioxidant, and an electrical component with a 3D structure using the same.
    Type: Application
    Filed: August 18, 2023
    Publication date: May 30, 2024
    Applicants: HYUNDAI MOBIS CO., LTD., Sonid Inc.
    Inventors: Jae Joon CHANG, Hyeon Don KIM, Eun Chang LEE, Jae Min LEE, Byeong Chan SONG, Hyun LEE, Tae Won HWANG, So Yeon LIM