Abstract: A light-emitting element package includes a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity. Each of the lead frames includes a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part width of the connection part is narrower than the width of the first part and the second part in a region adjacent to the connection part.

Abstract: An embodiment provides a light-emitting element package comprising: a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity, wherein each of the first lead frame and the second lead frame comprises: a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part, and the width of the connection part is narrower than the width of the first part and the width of the second part in a region adjacent to the connection part.

Abstract: A semiconductor chip package having a clip type lead frame and fabrication thereof. The package includes a semiconductor chip having a plurality of bond pads thereon, a first package body having a recess, a plurality of inner leads each connected electrically to a corresponding one of the bond pads, a plurality of outleads each extended from a corresponding one of the inner leads for covering along sides of the first package body, and a second package body which covers the semiconductor chip, a plurality of metallic wires and the inner leads.

Abstract: A stacked bottom lead package for use in semiconductor devices includes leads that are bent along with the circumference of the body which has been premolded, wherein a chip is included inside the premolded body. The package configuration prevents solder fatigue of the lead due to heat carried via the extended lead and emitted out of the chip and decreases the area required for stacking semiconductor packages.

Abstract: An improved lead frame with a pre-mold paddle for a semiconductor chip package which prevents delamination and cracking between a mold body and the pre-mold paddle on which a semiconductor chip in the semiconductor chip package is placed.

Abstract: The present invention relates to a stacked bottom lead package in semiconductor devices and a method thereof. More specifically, comprising leads that are bent along with the circumference of the body which has been premolded, wherein a chip is include inside the premolded body. The package and the method thereof according to the present invention enable a dual process, decreasing solder fatigue of the lead by carrying heat via the extended leads and emitting the heat out of the chip, and decreasing the area required for stacking semiconductor packages.

Abstract: A semiconductor chip package having a clip type lead frame and fabrication thereof. The package includes a semiconductor chip having a plurality of bond pads thereon, a first package body having a recess, a plurality of inner leads each connected electrically to a corresponding one of the bond pads, a plurality of outleads each extended from a corresponding one of the inner leads for covering along sides of the first package body, and a second package body which covers the semiconductor chip, a plurality of metallic wires and the inner leads.