Abstract: A display apparatus includes a red pixel area displaying red color, a green pixel area displaying green color, and a blue pixel area displaying blue color. A light-emitting device may be disposed in each pixel area. The light-emitting device of each pixel area may have a stacked structure of a lower electrode, a light-emitting layer and an upper electrode. An upper surface of the lower electrode in each pixel area may have a curvature different from an upper surface of the lower electrode in the pixel area displaying a different color from the corresponding pixel area. Thus, in the display apparatus, characteristics in a viewing angle can be improved.

Abstract: A display apparatus includes a first lower electrode disposed at a first pixel area of a device substrate, the first lower electrode including a curved region and an edge region disposed outside the curved region; an upper bank covering the edge region of the first lower electrode, the upper bank exposing the curved region of the first lower electrode; a first light-emitting layer disposed on the curved region of the first lower electrode; and a first upper electrode disposed on the first light-emitting layer, wherein the edge region of the first lower electrode has a shape extending in a direction inclined to an upper surface of the device substrate toward the first lower electrode.

Abstract: Disclosed is a light emitting display device configured to prevent a liquid encapsulation material from overflowing a dam and a method of manufacturing the same. The light emitting display device includes a nanostructure configured to surround an active area and provided on a first inorganic encapsulation layer over at least one dam pattern, and an organic encapsulation layer provided on the first inorganic encapsulation layer in an area inward from the nanostructure.

Abstract: A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.

Abstract: A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.

Abstract: A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.

Abstract: A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.