Abstract: A substrate processing system includes a loadlock chamber configured to receive a front opening unified pod (FOUP) that stores a plurality of wafers, a process chamber in which a semiconductor process is configured to be performed on the plurality of wafers, a transfer robot configured to transfer the plurality of wafers from the loadlock chamber to the process chamber, and a controller configured to determine a number of the plurality of wafers in the loadlock chamber and control cleaning of the process chamber based on the determined number of the plurality of wafers, where the plurality of wafers include a plurality of unprocessed wafers in the loadlock chamber, and a plurality of in-process wafers, the plurality of in-process wafers being removed from the loadlock chamber and transferred to the process chamber.

Abstract: The present invention relates to a non-contact portable tonometry system and tonometry method using a difference in infrared intensity. A nozzle module receives compressed air from a compressed air supply source and sprays the same through an air spray port to a cornea of a subject, thus to cause corneal deformation. An infrared ray sensor is disposed in the nozzle module to emit infrared rays to the cornea and measure an amount of light reflected from the cornea. A controller converts the amount of light measured by the infrared ray sensor before and after the deformation of corneal into intraocular pressure.

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Abstract: The present invention relates to a non-contact portable tonometry system and tonometry method using a difference in infrared intensity. A nozzle module receives compressed air from a compressed air supply source and sprays the same through an air spray port to a cornea of a subject, thus to cause corneal deformation. An infrared ray sensor is disposed in the nozzle module to emit infrared rays to the cornea and measure an amount of light reflected from the cornea. A controller converts the amount of light measured by the infrared ray sensor before and after the deformation of corneal into intraocular pressure.

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Abstract: An electronic musical instrument includes a database including timbre data corresponding to a plurality of musical instruments an acoustic data input unit configured to display an acoustic data input position corresponding to a selected one of the musical instruments, detect whether the acoustic data input position is touched, and receive information on the touched acoustic data input position a mouthpiece detachably provided and having a shape corresponding to a shape of a mouthpiece of the selected musical instrument a wind sensor unit configured to measure an amount of air to generate loudness data a control unit configured to receive timbre data corresponding to the information on the touched acoustic data input position, receive the loudness data from the wind sensor unit, and synthesize the timbre data and the loudness data to output an acoustic sound signal of the selected musical instrument and a power supply unit configured to supply power.

Abstract: A diagnosis system for pulsed plasma includes an optical emission sensor (OES) to receive light generated the pulsed plasma, the pulsed plasma having been generated in accordance with a pulse signal, a digitizer to synchronize the electrical signal with the pulse signal, and an analyzer to analyze the synchronized electrical signal.

Abstract: An electronic musical instrument includes a database including timbre data corresponding to a plurality of musical instruments an acoustic data input unit configured to display an acoustic data input position corresponding to a selected one of the musical instruments, detect whether the acoustic data input position is touched, and receive information on the touched acoustic data input position a mouthpiece detachably provided and having a shape corresponding to a shape of a mouthpiece of the selected musical instrument a wind sensor unit configured to measure an amount of air to generate loudness data a control unit configured to receive timbre data corresponding to the information on the touched acoustic data input position, receive the loudness data from the wind sensor unit, and synthesize the timbre data and the loudness data to output an acoustic sound signal of the selected musical instrument and a power supply unit configured to supply power.

Abstract: A diagnosis system for pulsed plasma includes an optical emission sensor (OES) to receive light generated the pulsed plasma, the pulsed plasma having been generated in accordance with a pulse signal, a digitizer to synchronize the electrical signal with the pulse signal, and an analyzer to analyze the synchronized electrical signal.

Abstract: A drive voltage generation circuit for an LED display device capable of increasing the input voltage range thereof is disclosed. The drive voltage generation circuit includes a booster that boosts an input voltage from an external source, to generate a boosted voltage, a protection switching element that controls whether or not the boosted voltage generated from the booster is to be output, in accordance with a switch control signal, a protection circuit that compares a level of the boosted voltage output from the booster via the protection switching element with a predetermined threshold voltage, selects one of a high voltage and a low voltage, based on a result of the comparison, and outputs the selected voltage as the switch control signal, and a discharger that discharges a low voltage node, to which the low voltage is applied.