Patents by Inventor Byeong Hoon YEON

Byeong Hoon YEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMOELECTRIC MODULE AND A VEHICLE INCLUDING THE SAME
    Publication number: 20230019266
    Abstract: A thermoelectric module includes a first electrode, a first oxidation preventing layer, a plurality of first bonding layers containing silver (Ag), a second oxidation preventing layer, a first plating layer, a thermoelectric element, a second plating layer, a third oxidation preventing layer, a second bonding layer containing silver (Ag), a fourth oxidation preventing layer, and a second electrode.
    Type: Application
    Filed: January 25, 2022
    Publication date: January 19, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, LT METAL CO., LTD.
    Inventors: Byung Wook Kim, Min Jae Lee, Byung Jin Hwang, Seung Jin Yang, Byeong Hoon Yeon, Kyoung Hyun Son, Bong Jung Jang, Tae Hee Lee, Seung Ho Yang, Joo Hyeon Park, Jung Ku Park
  • Thermoelectric module and method for manufacturing the same
    Patent number: 11355688
    Abstract: A thermoelectric module includes: an electrode; a double layer stacked on a thermoelectric pellet; and a solder layer interposed between the double layer and the electrode to bond the double layer to the electrode, the solder layer containing a Sn—Cu-based alloy. The solder layer is formed to have an interface with one of the double layer and the electrode and has at least one ? layer having an ? phase (Cu3Sn).
    Type: Grant
    Filed: April 21, 2018
    Date of Patent: June 7, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Hee Sung Metal LTD.
    Inventors: Jin Woo Kwak, Byung Wook Kim, Kyong Hwa Song, Byung Jin Hwang, Byeong Hoon Yeon, Kyoung Hyun Son, Jong Bae Kim, Seung Ho Yang, Jae Soung Park
  • THERMOELECTRIC MODULE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20190189887
    Abstract: A thermoelectric module includes: an electrode; a double layer stacked on a thermoelectric pellet; and a solder layer interposed between the double layer and the electrode to bond the double layer to the electrode, the solder layer containing a Sn—Cu-based alloy. The solder layer is formed to have an interface with one of the double layer and the electrode and has at least one ? layer having an ? phase (Cu3Sn).
    Type: Application
    Filed: April 21, 2018
    Publication date: June 20, 2019
    Inventors: Jin Woo Kwak, Byung Wook Kim, Kyong Hwa Song, Byung Jin Hwang, Byeong Hoon Yeon, Kyoung Hyun Son, Jong Bae Kim, Seung Ho Yang, Jae Soung Park
  • METHOD FOR MANUFACTURING BI-TE-BASED THERMOELECTRIC MATERIAL USING RESISTANCE-HEATING ELEMENT
    Publication number: 20180138385
    Abstract: The present invention relates to a method for manufacturing a Bi—Te-based thermoelectric material. More particularly, the present invention provides a novel manufacturing method capable of improving thermoelectric properties by controlling uniformity of the ribbon composition by precisely controlling the temperature of a rapid solidification process (RSP) used when manufacturing a metallic ribbon.
    Type: Application
    Filed: September 25, 2015
    Publication date: May 17, 2018
    Inventors: Byeong Hoon YEON, Jae-soung PARK, Seung Ho YANG