Abstract: A light-emitting element package includes a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity. Each of the lead frames includes a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part width of the connection part is narrower than the width of the first part and the second part in a region adjacent to the connection part.

Abstract: An embodiment provides a light-emitting element package comprising: a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity, wherein each of the first lead frame and the second lead frame comprises: a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part, and the width of the connection part is narrower than the width of the first part and the width of the second part in a region adjacent to the connection part.