Patents by Inventor Byeong-Hyeon Lee

Byeong-Hyeon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11919999
    Abstract: Provided are a method for preparing a polyetherketoneketone and a polyetherketoneketone prepared thereby, wherein, at the time of a polymerization reaction, nitrogen gas is blown into a liquid reaction medium while stirring, thereby quickly removing hydrochloric acid, which is a by-product generated during the reaction, and preventing aggregation of resin particles, thus suppressing the generation of scales.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: March 5, 2024
    Assignee: HANWHA CHEMICAL CORPORATION
    Inventors: Kwang Seok Jeong, Min Sung Kim, Jae Heon Kim, Ju Young Park, Cho Hee Ahn, Byeong Hyeon Lee, Sang Hyun Cho
  • Publication number: 20240044818
    Abstract: Disclosed are a sample holder for X-ray diffraction analysis and an X-ray diffraction analysis method using the same. The sample holder for X-ray diffraction analysis includes a housing part formed of a side wall and a bottom plate with an open upper portion thereof, the housing part including an inner space partitioned from the side wall and the bottom plate, a cover part configured to cover the upper portion of the housing part and to allow X-rays to pass therethrough, and a support part installed to be movable upwards and downwards in the inner space, the support part including a plate-shaped substrate having a predetermined area, the substrate having a sample placed thereon.
    Type: Application
    Filed: December 10, 2022
    Publication date: February 8, 2024
    Inventors: Yun Sung Kim, Yoon Kwang Lee, Ga Hyeon Im, Sang Heon Lee, Kyu Joon Lee, Jae Pyoung Ahn, Hae Ryoung Kim, Hyun Woo Gong, Byeong Hyeon Lee
  • Publication number: 20220306835
    Abstract: There is provided a method for preparing a polyisocyanate composition capable of improving transparency of a product, by mixing a phenol-based stabilizer in an amount of 1 to 1000 ppmw, based on the total weight of aromatic diisocynate, and then, introducing polyhydric alcohol to conduct a polymerization reaction, thereby inhibiting coloration and whitening due to oxygen or moisture during synthesis and purification processes.
    Type: Application
    Filed: August 20, 2020
    Publication date: September 29, 2022
    Inventors: Yujin SIM, Juyoung PARK, Byeong Hyeon LEE, Sanghyun CHO
  • Patent number: 10975021
    Abstract: The present invention relates to a method for preparing an aliphatic isocyanate capable of suppressing the occurrence of side reactions and the production of by-products. The method for preparing an aliphatic isocyanate comprises a step of reacting a salt of an aliphatic amine with phosgene, wherein the reaction step comprises a first reaction step in which phosgene is primarily added and reacted with the salt of an aliphatic amine salt at a temperature of 80 to 100° C., and a second reaction step in which phosgene is secondarily added and reacted with the resultant product of the first reaction step at a temperature of 120 to 160° C., and wherein the amount of the primarily added phosgene is a certain ratio of the total amount of the phosgene.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: April 13, 2021
    Assignee: HANWHA SOLUTIONS CORPORATION
    Inventors: Byeong Hyeon Lee, Ju Young Park, Cho Hee Ahn, Sang Hyun Cho
  • Patent number: 10941110
    Abstract: The present invention relates to a method for preparing an aliphatic isocyanate capable of suppressing the occurrence of side reactions and the production of by-products. The method for preparing an aliphatic isocyanate comprises a step of reacting a salt of an aliphatic amine with phosgene, wherein the reaction step comprises a first reaction step in which phosgene is primarily added and reacted with the salt of an aliphatic amine salt at a temperature of 80 to 100° C., and a second reaction step in which phosgene is secondarily added and reacted with the resultant product of the first reaction step at a temperature of 120 to 160° C., and wherein the amount of the primarily added phosgene is a certain ratio of the total amount of the phosgene.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: March 9, 2021
    Assignee: HANWHA SOLUTIONS CORPORATION
    Inventors: Byeong Hyeon Lee, Ju Young Park, Cho Hee Ahn, Sang Hyun Cho
  • Publication number: 20200339750
    Abstract: Provided are a method for preparing a polyetherketoneketone and a polyetherketoneketone prepared thereby, wherein, at the time of a polymerization reaction, nitrogen gas is blown into a liquid reaction medium while stirring, thereby quickly removing hydrochloric acid, which is a by-product generated during the reaction, and preventing aggregation of resin particles, thus suppressing the generation of scales.
    Type: Application
    Filed: November 16, 2018
    Publication date: October 29, 2020
    Applicant: HANWHA CHEMICAL CORPORATION
    Inventors: Kwang Seok JEONG, Min Sung KIM, Jae Heon KIM, Ju Young PARK, Cho Hee AHN, Byeong Hyeon LEE, Sang Hyun CHO
  • Publication number: 20200190022
    Abstract: The present invention relates to a method for preparing an aliphatic isocyanate capable of suppressing the occurrence of side reactions and the production of by-products. The method for preparing an aliphatic isocyanate comprises a step of reacting a salt of an aliphatic amine with phosgene, wherein the reaction step comprises a first reaction step in which phosgene is primarily added and reacted with the salt of an aliphatic amine salt at a temperature of 80 to 100° C., and a second reaction step in which phosgene is secondarily added and reacted with the resultant product of the first reaction step at a temperature of 120 to 160° C., and wherein the amount of the primarily added phosgene is a certain ratio of the total amount of the phosgene.
    Type: Application
    Filed: September 3, 2018
    Publication date: June 18, 2020
    Inventors: Byeong Hyeon LEE, Ju Young PARK, Cho Hee AHN, Sang Hyun CHO
  • Patent number: 7153740
    Abstract: For fabricating lean-free stacked capacitors, openings are formed through layers of materials including a layer of support material displaced from a bottom of the openings. A respective first electrode is formed for a respective capacitor within each of the openings. The layer of support material is patterned to form support structures around the first electrodes. Masking spacers are formed around exposed top portions of the first electrodes, and exposed portions of the support material are etched away to form the support structures. Such stacked capacitors are applied within a DRAM (dynamic random access memory).
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: December 26, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dae-Hwan Kim, Min Heo, Dong-Won Shin, Byeong-Hyeon Lee
  • Publication number: 20060211178
    Abstract: For fabricating lean-free stacked capacitors, openings are formed through layers of materials including a layer of support material displaced from a bottom of the openings. A respective first electrode is formed for a respective capacitor within each of the openings. The layer of support material is patterned to form support structures around the first electrodes. Masking spacers are formed around exposed top portions of the first electrodes, and exposed portions of the support material are etched away to form the support structures. Such stacked capacitors are applied within a DRAM (dynamic random access memory).
    Type: Application
    Filed: April 17, 2006
    Publication date: September 21, 2006
    Inventors: Dae-Hwan Kim, Min Huh, Dong-Won Shin, Byeong-Hyeon Lee
  • Publication number: 20050176210
    Abstract: For fabricating lean-free stacked capacitors, openings are formed through layers of materials including a layer of support material displaced from a bottom of the openings. A respective first electrode is formed for a respective capacitor within each of the openings. The layer of support material is patterned to form support structures around the first electrodes. Masking spacers are formed around exposed top portions of the first electrodes, and exposed portions of the support material are etched away to form the support structures. Such stacked capacitors are applied within a DRAM (dynamic random access memory).
    Type: Application
    Filed: May 25, 2004
    Publication date: August 11, 2005
    Inventors: Dae-Hwan Kim, Min Huh, Dong-Won Shin, Byeong-Hyeon Lee