Patents by Inventor Byeong Jae LIM

Byeong Jae LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240067784
    Abstract: An implementation relates to a polyester-based film having low hygroscopicity, a manufacturing method therefor, and a membrane electrode assembly comprising same, and the polyester-based film has excellent flexibility, adhesion and durability and has a moisture absorption represented by formula 1, which meets 0.25% or less, and thus has excellent hydrolysis resistance so as to be applied as a film for a fuel cell sub-gasket and exhibit excellent characteristics.
    Type: Application
    Filed: December 17, 2021
    Publication date: February 29, 2024
    Inventors: Young Min HEO, Byeong Jae LIM, Jewon YEON, Ki Youn SONG
  • Publication number: 20240002589
    Abstract: A polyester film according to an embodiment includes a polyester resin. The polyester resin includes a repeating unit having a cyclohexane skeleton and a repeating unit having a benzene ring. The polyester film has a base peak related to bending vibration of the benzene ring and a first peak related to C—O stretching vibration in a spectrum measured using a Fourier transform infrared spectrometer (FT-IR). The base peak is a peak at a wavenumber of 788 cm?1 to 798 cm?1. The first peak is a peak at a wavenumber of 1129 cm?1 to 1139 cm?1. The intensity of the base peak and the intensity of the first peak differ by ?0.05 to +0.05. According to an embodiment, a polyester resin having a controlled degree of crystallization can be applied to a film to impart excellent heat resistance, mechanical properties, and the like to the film.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 4, 2024
    Applicant: SK microworks Co., Ltd.
    Inventors: Byeong Jae LIM, Young Min HEO, Chul Kyu KIM
  • Publication number: 20230416478
    Abstract: Disclosed is a polyester film comprising a polycyclohexylenedimethylene terephthalate resin having a degree of crystallinity of 36% or less as measured using a differential scanning calorimeter.
    Type: Application
    Filed: May 31, 2023
    Publication date: December 28, 2023
    Applicant: SK microworks Co., Ltd.
    Inventors: Byeong Jae LIM, Young Min HEO, Chul Kyu KIM, Ki Youn SONG
  • Publication number: 20220411575
    Abstract: The present disclosure relates to a polyester resin composition including a polyester resin including a diol residue and a dicarboxylic acid residue, wherein the diol residue includes a cyclohexanedimethanol residue and the dicarboxylic acid residue includes an isophthalic acid residue and a terephthalic acid residue, wherein an amount of the isophthalic acid residue is 0 to 20 mol % when a total amount of the dicarboxylic acid residue is considered as 100 mol %, wherein an amount of the cyclohexanedimethanol residue is 50 to 100 mol % when a total amount of the diol residue is considered as 100 mol %, wherein the polyester resin composition includes an antioxidant, and wherein the antioxidant includes a phenol-based antioxidant, a phosphorus-based antioxidant, and a sulfur-based antioxidant.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 29, 2022
    Applicant: SKC Co., Ltd.
    Inventors: Young Min HEO, Jewon YEON, Byeong Jae LIM
  • Publication number: 20220348713
    Abstract: A film for an electronic board, according to one embodiment, has a low dielectric constant of 2.9 or lower at a frequency of 10-40 GHz, and thus can cause the signal transmission rate for a high frequency use, such as fifth generation (5G) mobile communication, to be superior to that of a conventional film for an electronic board. In addition, the film for an electronic board has flexibility and physicochemical characteristics that are greater than or equal to those of a conventional film, so as to be applicable to the manufacture of a laminate of a conductive film such as FCCL and an electronic board such as a FPCB, thereby enabling processability, durability, transmission capacity and the like to be improved.
    Type: Application
    Filed: September 24, 2020
    Publication date: November 3, 2022
    Inventors: Young Min HEO, Ilho NOH, Sang Mook KIM, Byeong Jae LIM
  • Publication number: 20220330423
    Abstract: A film for an electronic substrate according to an embodiment has a moisture-absorption rate of less than 0.3% of the initial weight when immersed in water for 24 hours, and thus is less susceptible than existing films for electronic substrates are to changes in dimension or degradation in electrical characteristics caused by containing moisture according to changes in temperature and humidity. Also, the film for an electronic substrate is equal or superior to existing films in terms of flexibility and physicochemical characteristics, and thus may be applied to the manufacture of laminates with a conductive film such as FCCL and electronic substrates such as FPCB to improve processability, durability, transmission capacity, etc.
    Type: Application
    Filed: September 18, 2020
    Publication date: October 13, 2022
    Inventors: Young Min HEO, Ilho NOH, Sang Mook KIM, Byeong Jae LIM