Patents by Inventor Byeong K. Ju

Byeong K. Ju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for silicon fusion bonding of silicon substrates using wet oxygen atmosphere
    Patent number: 5273205
    Abstract: A silicon fusion bonding method and apparatus for bonding silicon substrates in wet oxygen atmosphere. The method comprises a stabilizing step of the silicon substrates, which has been processed in a pre-process, in the wet oxygen atmosphere, a primarily bonding step of the silicon substrates to each other and a heat-treating step of the silicon substrates at a high temperature in the wet oxygen atmosphere in order to remove micro-gaps from a junction interface by virtue of filling-up effect of micro-gaps by interfacial oxide growing.
    Type: Grant
    Filed: November 17, 1992
    Date of Patent: December 28, 1993
    Assignee: Korea Institute of Science and Technology
    Inventors: Byeong K. Ju, Myung H. Oh, Kwang N. Kang