Patents by Inventor Byeong Moon

Byeong Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-LAYERED CHIP ELECTRONIC COMPONENT
    Publication number: 20140062643
    Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40?Ai:Ao?1.03 is satisfied.
    Type: Application
    Filed: December 14, 2012
    Publication date: March 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO" L TO,
    Inventors: Jin Woo Hahn, So Yeon Song, Sung Yong An, Byeong Moon, Soo Hwan Son