Abstract: The present invention provides an electromagnetic wave-absorbing composite material and a manufacturing method therefor, the electromagnetic wave-absorbing composite material comprising: a polymer composite including a refractive index-adjusting material therein; and a plurality of conductive wires formed on at least one surface of the polymer composite, wherein electromagnetic waves reflected in a matching frequency (f) range derived through Mathematical Formulas 1 to 3 described in the present invention are 0.2 dB or less.

Abstract: An atomic layer etching method using a ligand exchange reaction may include a substrate providing step of putting a substrate with a thin film formed thereon into a reaction chamber, a halogenated thin film forming step of forming a halogenated thin film on a surface of the thin film by infusing a halogenated gas into the reaction chamber, and an etching step of etching the halogenated thin film by infusing a ligand without a metal or metal precursor into the reaction chamber with the substrate with the halogenated thin film.

Abstract: Disclosed herein is a circuit board including: a core layer; first and second layers sequentially stacked on the core layer, wherein prominence-depressions having different sizes are formed on a surface of the first layer in each region of the core layer.

Abstract: The present invention relates to a jig unit for fixing a substrate and a substrate transfer apparatus including the same. In accordance with an embodiment of the present invention, a jig unit for fixing a substrate including: a support part for supporting an edge-side lower portion of a substrate; a hinge part having a hinge formed at a predetermined height from an upper surface of the substrate supported to the support part and rotating so that a rotation range by the hinge applies a force to the edge side of the substrate beyond the range that vertically presses the upper surface of the substrate; and a substrate fixing part for fixing the substrate to the support unit flatly by applying tension to the edge side of the substrate simultaneously with pressing the upper surface of the substrate is provided.