Abstract: A circuit board according to an embodiment includes an insulating layer including first to third regions; an outer circuit pattern disposed on upper surfaces of the first to third regions of the insulating layer, and a solder resist including a first part disposed on the first region of the insulating layer, a second part disposed on the second region, and a third part disposed on the third region, wherein the outer circuit pattern includes a first trace disposed on an upper surface of the first region of the insulating layer; a first pad disposed on an upper surface of the first region of the insulating layer; and a second trace disposed on an upper surface of the third region of the insulating layer; wherein an upper surface of the first part of the solder resist is positioned lower than an upper surface of the first trace; and a height of the first trace is different from a height of the first pad.