Patents by Inventor Byeong Yeop Lee

Byeong Yeop Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die roll for forming soft gel capsules
    Patent number: 12233030
    Abstract: A die roll may be used to form soft gel capsules via rotary encapsulation. The die roll may include a plurality of cavities. At least one cavity includes a cavity length, and the die roll includes a first die surface provided along a first portion of the cavity length and a second die surface provided along a second portion of the cavity length. The second die surface may be elevated relative to the first die surface.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: February 25, 2025
    Assignee: CAPTEK Softgel International, Inc.
    Inventors: Jung Ku Cho, Bibu Philip George, Byeong Yeop Lee, Steven Eikichi Quan
  • DIE ROLL FOR FORMING SOFT GEL CAPSULES
    Publication number: 20230106844
    Abstract: A die roll may be used to form soft gel capsules via rotary encapsulation. The die roll may include a plurality of cavities. At least one cavity includes a cavity length, and the die roll includes a first die surface provided along a first portion of the cavity length and a second die surface provided along a second portion of the cavity length. The second die surface may be elevated relative to the first die surface.
    Type: Application
    Filed: December 9, 2022
    Publication date: April 6, 2023
    Applicant: CAPTEK® Softgel International
    Inventors: Jung Ku Cho, Bibu Philip George, John Thomas Puckett, Byeong Yeop Lee, Steven Eikichi Quan