Abstract: A semiconductor package includes a first semiconductor chip having a first semiconductor chip body including a first circuit region and peripheral regions arranged around the first circuit region. A first bonding pad group is arranged within the first circuit region and includes a plurality of bonding pads. A first redistribution group including a plurality of redistributions is electrically connected to the respective bonding pads and extends towards the peripheral regions. The package further includes a second semiconductor chip having a second semiconductor chip body including a second circuit region opposing the first circuit region. A second bonding pad group is arranged within the second circuit region and corresponds to the first bonding pad group. A second redistribution group is electrically connected to the respective bonding pads of the second bonding pad group. Redistribution connection members are used to electrically connect the first redistribution group to the second redistribution group.