Patents by Inventor Byeonggeon KIM
Byeonggeon KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11296060Abstract: An LED pixel device is disclosed. The LED pixel device includes a first light-transmitting substrate, a second light-transmitting substrate overlying the first light-transmitting substrate, a third light-transmitting substrate overlying the second light-transmitting substrate, a first light-emitting cell underlying the first light-transmitting substrate, a second light-emitting cell interposed between the first light-transmitting substrate and the second light-transmitting substrate, and a third light-emitting cell interposed between the second light-transmitting substrate and the third light-transmitting substrate. The first light-emitting cell, the second light-emitting cell, and the third light-emitting cell emit light of different wavelengths.Type: GrantFiled: June 4, 2018Date of Patent: April 5, 2022Assignee: LUMENS CO., LTD.Inventors: Seunghyun Oh, Sungsik Jo, Junghyun Park, Byeonggeon Kim
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Patent number: 10957835Abstract: A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.Type: GrantFiled: December 17, 2019Date of Patent: March 23, 2021Assignee: LUMENS CO., LTD.Inventors: Seunghyun Oh, Sungsik Jo, Junghyun Park, Byeonggeon Kim
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Publication number: 20200212017Abstract: An LED pixel device is disclosed. The LED pixel device includes a first light-transmitting substrate, a second light-transmitting substrate overlying the first light-transmitting substrate, a third light-transmitting substrate overlying the second light-transmitting substrate, a first light-emitting cell underlying the first light-transmitting substrate, a second light-emitting cell interposed between the first light-transmitting substrate and the second light-transmitting substrate, and a third light-emitting cell interposed between the second light-transmitting substrate and the third light-transmitting substrate. The first light-emitting cell, the second light-emitting cell, and the third light-emitting cell emit light of different wavelengths.Type: ApplicationFiled: June 4, 2018Publication date: July 2, 2020Applicant: LUMENS CO., LTD.Inventors: Seunghyun OH, Sungsik JO, Junghyun PARK, Byeonggeon KIM
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Publication number: 20200168769Abstract: An LED package is disclosed. The LED package includes: a metal reflector having a cavity formed therein; an LED chip arranged on the bottom of the cavity of the reflector; a wavelength converting panel including a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged on the cavity of the reflector; and a sealing member disposed on the side surface of the lower glass plate and the side surface of the upper glass plate and connecting the wavelength converting panel to the reflector.Type: ApplicationFiled: January 29, 2020Publication date: May 28, 2020Applicant: LUMENS CO., LTD.Inventors: Seunghyun OH, Sungsik JO, Byeonggeon KIM
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Publication number: 20200127183Abstract: A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.Type: ApplicationFiled: December 17, 2019Publication date: April 23, 2020Applicant: LUMENS CO., LTD.Inventors: Seunghyun OH, Sungsik JO, Junghyun PARK, Byeonggeon KIM
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Patent number: 10586897Abstract: An LED package is disclosed. The LED package includes: a metal reflector having a cavity formed therein; an LED chip arranged on the bottom of the cavity of the reflector; a wavelength converting panel including a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged on the cavity of the reflector; and a sealing member disposed on the side surface of the lower glass plate and the side surface of the upper glass plate and connecting the wavelength converting panel to the reflector.Type: GrantFiled: October 17, 2018Date of Patent: March 10, 2020Assignee: LUMENS CO., LTD.Inventors: Seunghyun Oh, Sungsik Jo, Byeonggeon Kim
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Patent number: 10546989Abstract: A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.Type: GrantFiled: July 19, 2018Date of Patent: January 28, 2020Assignee: LUMENS CO., LTD.Inventors: Seunghyun Oh, Sungsik Jo, Junghyun Park, Byeonggeon Kim
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Patent number: 10364947Abstract: An LED module is disclosed. The LED module includes: light sources elongated in a first direction; a mount supporting the light sources; and a composite reflector integrated with the mount to guide light received from the light sources. The composite reflector includes a first region arranged adjacent to the light sources to reflect light in a second direction substantially orthogonal to the first direction, a third region arranged away from the mount to reflect light in the second direction substantially orthogonal to the first direction, and a second region whose portions overlap the first region and the third region and formed with a plurality of diffraction lines through which light is diffused in the second direction. The diffraction lines formed on the composite reflector diffract incident light and direct the diffracted light toward the light receiving unit.Type: GrantFiled: January 29, 2018Date of Patent: July 30, 2019Assignee: LUMENS CO., LTD.Inventors: Sungsik Jo, Seunghyun Oh, Seunghoon Lee, Junghyun Park, Byeonggeon Kim
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Publication number: 20190207063Abstract: A light emitting device is disclosed. The light emitting device includes: an LED chip outputting excitation light; first converting materials receiving the excitation light to output light having a first peak intensity; second converting materials receiving the excitation light to output light having a second peak intensity and absorbing non-radiative energy from the first converting materials to output light having a third peak intensity higher than the second peak intensity when excited together with the first converting materials by the excitation light; and a light transmitting member transmitting light in a wavelength region corresponding to the third peak intensity and blocking light in the other wavelength regions.Type: ApplicationFiled: December 18, 2018Publication date: July 4, 2019Applicant: LUMENS CO., LTD.Inventors: Byeonggeon KIM, Sungsik JO
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Publication number: 20190140147Abstract: An LED package is disclosed. The LED package includes: a metal reflector having a cavity formed therein; an LED chip arranged on the bottom of the cavity of the reflector; a wavelength converting panel including a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged on the cavity of the reflector; and a sealing member disposed on the side surface of the lower glass plate and the side surface of the upper glass plate and connecting the wavelength converting panel to the reflector.Type: ApplicationFiled: October 17, 2018Publication date: May 9, 2019Applicant: LUMENS CO., LTD.Inventors: Seunghyun OH, Sungsik JO, Byeonggeon KIM
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Publication number: 20190058099Abstract: A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.Type: ApplicationFiled: July 19, 2018Publication date: February 21, 2019Applicant: LUMENS CO., LTD.Inventors: Seunghyun OH, Sungsik JO, Junghyun PARK, Byeonggeon KIM
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Publication number: 20180252373Abstract: An LED module is disclosed. The LED module includes: light sources elongated in a first direction; a mount supporting the light sources; and a composite reflector integrated with the mount to guide light received from the light sources. The composite reflector includes a first region arranged adjacent to the light sources to reflect light in a second direction substantially orthogonal to the first direction, a third region arranged away from the mount to reflect light in the second direction substantially orthogonal to the first direction, and a second region whose portions overlap the first region and the third region and formed with a plurality of diffraction lines through which light is diffused in the second direction. The diffraction lines formed on the composite reflector diffract incident light and direct the diffracted light toward the light receiving unit.Type: ApplicationFiled: January 29, 2018Publication date: September 6, 2018Applicant: LUMENS CO., LTD.Inventors: Sungsik JO, Seunghyun OH, Seunghoon LEE, Junghyun PARK, Byeonggeon KIM
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Patent number: D840959Type: GrantFiled: December 20, 2017Date of Patent: February 19, 2019Assignee: LUMENS CO., LTD.Inventors: Seunghyun Oh, Seunghoon Lee, Sungsik Jo, Junghyun Park, Byeonggeon Kim
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Patent number: D846510Type: GrantFiled: December 20, 2017Date of Patent: April 23, 2019Assignee: LUMENS CO., LTD.Inventors: Seunghyun Oh, Seunghoon Lee, Sungsik Jo, Junghyun Park, Byeonggeon Kim