Patents by Inventor Byeongguk Kim

Byeongguk Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11938538
    Abstract: Provided is a method of producing a metal-plastic multi-layered hybrid structure by using laser three-dimensional (3D) printing, the method including printing a metal structure on a substrate by using a first laser, patterning an upper surface of the metal structure by using the first laser, printing a polymer bonding layer on the patterned metal structure by using the first laser, and printing a polymer structure on the polymer bonding layer by using a second laser having a wavelength longer than a wavelength of the first laser, wherein the printing of the polymer bonding layer includes forming an intermediate phase at an interface between the metal structure and the polymer bonding layer. A layered structure produced using the above method may include the intermediate phase having the effect of an oxygen inclusion connecting a metal and a polymer.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: March 26, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Junyeon Hwang, Siwon Yu, Byeongguk Kim
  • Publication number: 20230079537
    Abstract: Provided is a method of producing a metal-plastic multi-layered hybrid structure by using laser three-dimensional (3D) printing, the method including printing a metal structure on a substrate by using a first laser, patterning an upper surface of the metal structure by using the first laser, printing a polymer bonding layer on the patterned metal structure by using the first laser, and printing a polymer structure on the polymer bonding layer by using a second laser having a wavelength longer than a wavelength of the first laser, wherein the printing of the polymer bonding layer includes forming an intermediate phase at an interface between the metal structure and the polymer bonding layer. A layered structure produced using the above method may include the intermediate phase having the effect of an oxygen inclusion connecting a metal and a polymer.
    Type: Application
    Filed: August 29, 2022
    Publication date: March 16, 2023
    Inventors: Junyeon HWANG, Siwon Yu, Byeongguk Kim