Abstract: The present invention relates to a solder resist composition, and more specifically, to: a solder resist composition that can be used to obtain high reflectance, excellent yellowing resistance, excellent crack resistance, high resolution and flatness, excellent sensitivity, developability, adhesion, solder heat resistance, pencil hardness, solvent resistance, HAST resistance, and high reflectance and high gloss after a HAST test; a dry film and a printed wiring board which include a solder resist layer obtained therefrom; and methods for manufacturing same.

Abstract: A system for providing part selection information based on a wireless network is provided. The system includes a wireless network, a plurality of display terminals adhered to a plurality of boxes including predetermined parts which display part receipt guidance information based on externally received part selection command, and a management computer which controls and manages an operation of the entire system. The management computer includes a management table to which identification information on parts and display terminals is mapped. The management computer transmits the part selection command to a display terminal corresponding to identification information on the display terminal that is externally input.