Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract: An apparatus for manufacturing a semiconductor package includes at least a first mold, a rotator, and a driver. The first mold has a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold are brought together. The rotator is coupled to the first mold, and the driver is between the first mold and a rotating axis of the rotator. The driver supplies a molding resin into the cavity based on centrifugal force generated when the rotator rotates on the rotating axis.

Abstract: An apparatus for manufacturing a semiconductor package includes at least a first mold, a rotator, and a driver. The first mold has a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold are brought together. The rotator is coupled to the first mold, and the driver is between the first mold and a rotating axis of the rotator. The driver supplies a molding resin into the cavity based on centrifugal force generated when the rotator rotates on the rotating axis.