Patents by Inventor Byeung Kyu PARK

Byeung Kyu PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220078910
    Abstract: A printed circuit board includes: a first insulating layer; a first circuit layer disposed on one surface of the first insulating layer; a second insulating layer disposed on the first insulating layer and covering at least a portion of the first circuit layer; a via conductor passing through the second insulating layer and connected to the first circuit layer; a via land connected to the via conductor in an upper portion of the via conductor; and a second circuit layer disposed on the second insulating layer and connected to the via land. The via conductor and the via land have a first interface where the via conductor and the via land are in contact with each other.
    Type: Application
    Filed: November 25, 2020
    Publication date: March 10, 2022
    Inventors: Byeung Kyu PARK, Ha Il KIM, Young Man KIM, Bong Ki SONG, Eun Hee KIM, Jong Hoe PARK, Sun Young CHOI