Abstract: Disclosed herein are an apparatus and a method for driving a gyroscope sensor. The apparatus for driving a gyroscope sensor includes: a detection module; a phase conversion module; an inversion module; a switch module selecting and outputting any one of the driving voltage and the inversion voltage for each axis; a driving module supplying driving voltage of a driving axis at the time of the driving and supplying inversion voltage at the time of stopping the driving; and a control unit passing the driving voltage of the driving axis by controlling the switch module according to a switching control signal at the time of the driving and passing the inversion voltage of each axis by controlling the switch module according to the switching control signal at the time of stopping the driving.

Abstract: Disclosed herein are an apparatus and a method for driving a gyroscope sensor. The apparatus for driving a gyroscope sensor includes: a detection module; a phase conversion module; an inversion module; a switch module selecting and outputting any one of the driving voltage and the inversion voltage for each axis; a driving module supplying driving voltage of a driving axis at the time of the driving and supplying inversion voltage at the time of stopping the driving; and a control unit passing the driving voltage of the driving axis by controlling the switch module according to a switching control signal at the time of the driving and passing the inversion voltage of each axis by controlling the switch module according to the switching control signal at the time of stopping the driving.

Abstract: Provided are a contact-force sensor package and a method of fabricating the same. The contact-force sensor package includes an elastic layer comprising a side that contacts a source of a contact-force; and a substrate layer adhered to the opposing side of the elastic layer from the side that contacts the source of the contact-force and comprising a cantilever beam separated from the elastic layer and deformed due to the contact-force, a pillar extending from a free end portion of the cantilever beam to the elastic layer and transferring the contact-force from the elastic layer to the cantilever beam, and a deformation sensing element for generating an electrical signal that is proportional to a degree of deformation of the cantilever beam.

Abstract: Disclosed herein are an apparatus and a method for driving a gyroscope sensor. The apparatus for driving a gyroscope sensor includes: a detection module; a phase conversion module; an inversion module; a switch module selecting and outputting any one of the driving voltage and the inversion voltage for each axis; a driving module supplying driving voltage of a driving axis at the time of the driving and supplying inversion voltage at the time of stopping the driving; and a control unit passing the driving voltage of the driving axis by controlling the switch module according to a switching control signal at the time of the driving and passing the inversion voltage of each axis by controlling the switch module according to the switching control signal at the time of stopping the driving.

Abstract: Disclosed herein is an apparatus for driving a multi-axial angular driving sensor. The apparatus includes a driving unit; a timing control unit outputting the start control signal to the driving unit, wherein the start control signal, when one axis is driven based on an axis drive stabilization section and a drive off section,; and a sensing unit. Therefore, the present invention can significantly improve the sampling time in a multi-axial sensor.

Abstract: Provided are a print head error checking apparatus and method in which the residual oscillation of a piezoelectric element corresponding to each nozzle of a print head is sensed, the sensed residual oscillation of each piezoelectric element and a predetermined residual oscillation of the piezoelectric element are compared to each other, and whether a print head normally operates is checked in consideration of the results of the comparisons.

Abstract: Provided are a contact-force sensor package and a method of fabricating the same. The contact-force sensor package includes an elastic layer comprising a side that contacts a source of a contact-force; and a substrate layer adhered to the opposing side of the elastic layer from the side that contacts the source of the contact-force and comprising a cantilever beam separated from the elastic layer and deformed due to the contact-force, a pillar extending from a free end portion of the cantilever beam to the elastic layer and transferring the contact-force from the elastic layer to the cantilever beam, and a deformation sensing element for generating an electrical signal that is proportional to a degree of deformation of the cantilever beam.

Abstract: A small structure which uses bonding wires to prevent disturbance and provide support and a method of fabricating the same are provided. The small structure includes a floating body having a plurality of first contact pads, a base having a plurality of second contact pads, and a plurality of bonding wires electrically connecting the first and second contact pads and elastically supporting the floating body. The method of fabricating the small structure includes preparing a base, forming a sacrificial layer on the base, disposing a floating body on the sacrificial layer, connecting the base and the floating body with bonding wires, and removing the sacrificial layer. Thereby, fabrication costs of the small structure are reduced.

Abstract: Provided are a print head error checking apparatus and method in which the residual oscillation of a piezoelectric element corresponding to each nozzle of a print head is sensed, the sensed residual oscillation of each piezoelectric element and a predetermined residual oscillation of the piezoelectric element are compared to each other, and whether a print head normally operates is checked in consideration of the results of the comparisons.

Abstract: An apparatus for driving an actuator includes a power unit, a sensing unit, and a first outer capacitor. The power unit provides first and second power in mutually reverse phases to first and second activating vibration plate, respectively. The sensing unit senses a displacement of a suspended vibration plate according to a result of sensing by a sensing plate. The first outer capacitor is disposed between a first power terminal connecting the power unit to the actuator and a sensing terminal connecting the sensing plate to the sensing unit.

Abstract: A scanning apparatus and a scanning method are provided.

Abstract: An apparatus and method are provided for displaying an image by raster scanning using a mirror. The apparatus includes a mirror control unit that controls a vertical motion of the mirror to be a triangle wave motion, and a scanning unit that repeatedly performs a forward scan and a reverse scan over the mirror in an orthogonal direction. The apparatus can reduce ringing by controlling the vertical motion of the mirror to be an isosceles triangle wave motion and increasing a sawtooth flyback time to about 50%. Also, since the reverse scan is performed during flyback after the forward scan is performed, the apparatus can compensate for a reduction in screen brightness, which is caused by the increase of the sawtooth flyback time to about 50%.

Abstract: A vertical offset structure and a method for fabricating the same. The vertical offset structure includes a substrate; a fixed electrode fixing portion formed on the substrate; a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance; a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves into a direction substantially perpendicular to a plate surface of the substrate; a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode.

Abstract: A method for fabricating a vertical offset structure that forms a complete vertical offset on a wafer includes a first trench forming step of forming first trenches on a wafer; a first etching step of performing a first patterning for determining etching positions of second and third trenches by depositing a first thin film on the wafer, performing a second patterning for temporarily protecting the etching position of the third trench by depositing a second thin film on the first thin film and the wafer, and then forming the second trenches by etching the wafer; a second etching step of forming a protection layer on side surfaces of the second trenches and then vertically extending the second trenches by etching the wafer; a third etching step of removing the second thin film and then forming the third trench by etching a position from which the second thin film is removed; and a fourth etching step of horizontally extending the second trenches vertically extended at the second etching step and the third tren

Abstract: Apparatus and a method for driving and detecting a motion of MEMS structure using single electrode. Apparatus includes a driving signal generation part driving MEMS structure; a motion detection part detecting motion of MEMS structure and outputting a motion current signal; an amplification part amplifying motion current signal and outputting a motion voltage signal; a gain adjustment part amplifying driving signal and outputting an amplified driving signal; a differential circuit part adding and subtracting with respect to signals output from the amplifying part and the gain adjustment part and outputting a motion signal without the driving signal; and a motion signal detection part selecting and outputting a motion signal of a predetermined frequency from the motion signal output from the differential circuit part. The variable capacitor is configured by a movable electrode plate integrally formed with MEMS structure and a fixed electrode plate disposed opposite to the movable electrode plate.

Abstract: A small structure which uses bonding wires to prevent disturbance and provide support and a method of fabricating the same are provided. The small structure includes a floating body having a plurality of first contact pads, a base having a plurality of second contact pads, and a plurality of bonding wires electrically connecting the first and second contact pads and elastically supporting the floating body. The method of fabricating the small structure includes preparing a base, forming a sacrificial layer on the base, disposing a floating body on the sacrificial layer, connecting the base and the floating body with bonding wires, and removing the sacrificial layer. Thereby, fabrication costs of the small structure are reduced.

Abstract: A vertical offset structure and a method for fabricating the same. The vertical offset structure includes a substrate; a fixed electrode fixing portion formed on the substrate; a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance; a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves into a direction substantially perpendicular to a plate surface of the substrate; a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode.

Abstract: A MEMS gyroscope with coupling springs and mass bodies symmetrical to one another and relatively movable in a vertical direction with respect to a substrate, where a coupling spring connects the mass bodies and moves the mass bodies in a vertical direction as another one of the mass bodies moves in the opposite vertical direction.

Abstract: A method for fabricating a vertical offset structure that forms a complete vertical offset on a wafer includes a first trench forming step of forming first trenches on a wafer; a first etching step of performing a first patterning for determining etching positions of second and third trenches by depositing a first thin film on the wafer, performing a second patterning for temporarily protecting the etching position of the third trench by depositing a second thin film on the first thin film and the wafer, and then forming the second trenches by etching the wafer; a second etching step of forming a protection layer on side surfaces of the second trenches and then vertically extending the second trenches by etching the wafer; a third etching step of removing the second thin film and then forming the third trench by etching a position from which the second thin film is removed; and a fourth etching step of horizontally extending the second trenches vertically extended at the second etching step and the third tren

Abstract: A rotation-type decoupled MEMS gyroscope including a drive body movable about the X-axis, a sensing body movable about the Z-axis, a medium body moving together with the drive body about the X-axis and the sensing body about the Z-axis. The drive body is fixed on a substrate by a first torsion spring torsion-deformed about the X-axis, and the medium body is connected to the drive body by a first bending spring bending-deformed about the Z-axis. The sensing body is connected to the medium body by a second torsion spring torsion-deformed about the X-axis and fixed to the substrate by a second bending spring bending-deformed about the Z-axis. If angular velocity is applied relative to the Y-axis while the drive body vibrates in a certain range about the X-axis by a driving electrode, the sensing body rotates about the Z-axis by the Coriolis force and a sensing electrode senses the rotation.