Abstract: Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.

Abstract: A photolithography system includes an application and development module, an exposure module, and an interface module interposed between the first two modules. Bake units for performing a post-exposure bake process are provided to both the application and development module and the interface module. The interface module also includes a buffer unit. An error detected within the application and development module would ordinarily stop operation of the post-exposure bake process in the application and development module. Upon detection of the error, communication between the auxiliary controller controlling the bake unit of the interface module and the exposure controller is made, and a wafer processed at the exposure module undergoes a post-exposure bake process at the bake unit of the interface module, and then is stored in the buffer unit of the interface module.

Abstract: A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.

Abstract: An apparatus for forming identifying characters on semiconductor devices includes a laser generation unit, a laser transmission unit, a stage and a control unit. The laser generation unit may generate a laser beam having a pulse duration shorter than a heat diffusion time of a wafer. The laser transmission unit may transmit the laser beam to vary a path of the laser beam. The wafer may be mounted on the stage and, and the control unit may control the laser generation unit, the laser transmission unit and the stage.

Abstract: A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.

Abstract: A temperature controller for a semiconductor-fabricating tool includes a Peltier element disposed on an outer wall of the semiconductor-fabricating tool, and a battery for providing a current to the Peltier element. The Peltier element a heat-emitting plate for emitting heat by the current provided thereto, and a heat-absorbing plate for absorbing a heat. A first temperature sensor senses a temperature of the Peltier element. A second temperature sensor senses an interior temperature of the semiconductor-fabricating tool. A controller controls an amount of the current provided to the Peltier element in accordance with a temperature of the Peltier element sensed by the first temperature sensor and an interior temperature of the semiconductor-fabricating tool sensed by the second temperature sensor.

Abstract: Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.

Abstract: A temperature controller for a semiconductor-fabricating tool includes a Peltier element disposed on an outer wall of the semiconductor-fabricating tool, and a battery for providing a current to the Peltier element. The Peltier element a heat-emitting plate for emitting heat by the current provided thereto, and a heat-absorbing plate for absorbing a heat. A first temperature sensor senses a temperature of the Peltier element. A second temperature sensor senses an interior temperature of the semiconductor-fabricating tool. A controller controls an amount of the current provided to the Peltier element in accordance with a temperature of the Peltier element sensed by the first temperature sensor and an interior temperature of the semiconductor-fabricating tool sensed by the second temperature sensor.

Abstract: A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.