Patents by Inventor Byong-Do Na

Byong-Do Na has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molding resin tablet feeding apparatus having weighing unit
    Patent number: 7501590
    Abstract: A molding resin tablet feeding apparatus may have a tablet weighing unit for weighing a molding resin tablet to sort out a faulty molding resin tablet. The weighing unit may be elastically deformed according to the weight of the molding resin tablet, and may further include a strain gauge for outputting an electric change caused by the elastic deformation. A controller may compare the electric change to tablet weight information to determine the validity of the molding resin tablet.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: March 10, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ok-Sun Jung, Hee-Chul Kang, Byong-Do Na, Young-Jin Hwang, Do-Woo Lee, Yong-Hwan Kim, Hee-Ju Seo
  • Molding resin tablet feeding apparatus having weighing unit
    Publication number: 20070023208
    Abstract: A molding resin tablet feeding apparatus may have a tablet weighing unit for weighing a molding resin tablet to sort out a faulty molding resin tablet. The weighing unit may be elastically deformed according to the weight of the molding resin tablet, and may further include a strain gauge for outputting an electric change caused by the elastic deformation. A controller may compare the electric change to tablet weight information to determine the validity of the molding resin tablet.
    Type: Application
    Filed: December 27, 2005
    Publication date: February 1, 2007
    Inventors: Ok-Sun Jung, Hee-Chul Kang, Byong-Do Na, Young-Jin Hwang, Do-Woo Lee, Yong-Hwan Kim, Hee-Ju Seo
  • Apparatus and method for forming leads and removing tin dust from leads
    Patent number: 6085804
    Abstract: A lead forming apparatus and a method for removing tin dust from the surface of the outer leads of semiconductor package are disclosed. The apparatus, in which a brushing operation removes tin dust from the outer leads, includes a supplier part; a lead forming part; a collection part; an intermediate post; a package transportation part; a brush block; and a brush transportation part. The method includes steps of providing a leadframe, forming the package leads, removing tin dust from the leads, and collecting the packages in a container.
    Type: Grant
    Filed: December 30, 1998
    Date of Patent: July 11, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun Hyuk Choi, Tai Kew Choi, Gyu Han Bae, Byong Do Na