Patents by Inventor Byong Heo

Byong Heo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12073569
    Abstract: Provided is a method and apparatus for eye tracking. An eye tracking method includes detecting an eye area corresponding to an eye of a user in a first frame of an image; determining an attribute of the eye area; selecting an eye tracker from a plurality of different eye trackers, the eye tracker corresponding to the determined attribute of the eye area; and tracking the eye of the user in a second frame of the image based on the selected eye tracker, the second frame being subsequent to the first frame.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: August 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jingu Heo, Dongwoo Kang, Byong Min Kang
  • Patent number: 12056844
    Abstract: A method with image processing includes: receiving an input image including Bayer images captured by a plurality of lenses included in a lens assembly; generating channel separation images by separating each of the Bayer images by a plurality of channels; determining corresponding points such that pixels in the channel separation images are displayed at the same position on a projection plane, for each of the plurality of lenses; performing binning on the channel separation images, based on a brightness difference and a distance difference between a target corresponding point and a center of a pixel including the target corresponding point, corresponding to each of the corresponding points in channel separation images that correspond to a same channel and that are combined into one image, for each of the plurality of lenses; restoring the input image for each of the plurality of lenses based on binned images generated by performing the binning; and outputting the restored input image.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: August 6, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byong Min Kang, Dong Kyung Nam, Yang Ho Cho, Jingu Heo
  • Publication number: 20070272827
    Abstract: An image sensor package and a method for manufacturing the same are disclosed. For example, a mount holder is directly attached on an image sensor die, not a substrate. Here, on the mount holder, a lens or a barrel having lens are attached. Also, the mount holder is interlocked by an encapsulant, so that it is not easily separated from the image sensor. Accordingly, the width of the mount holder can be smaller than that of the image sensor die, so that the entire width of the image sensor package becomes smaller. Moreover, the electrically conductive wire is located at the outside of the mount holder and is perfectly surrounded by the encapsulant, thereby preventing the oxidization of the wire.
    Type: Application
    Filed: April 27, 2005
    Publication date: November 29, 2007
    Inventors: Byong Heo, Won Lee, Kyong Kim