Abstract: A semiconductor test system capable of performing a virtual test and a semiconductor test method thereof. The semiconductor test system includes a tester providing a test signal and an emulator providing a virtual test result to the tester in response to the test signal. The emulator includes virtual prober software to obtain the virtual test result.

Abstract: An apparatus for testing electrical characteristics of a semiconductor workpiece includes a probe card having probes and signal pads electrically connected to the probes, wherein the probes are in contact with a workpiece during a test process; a test head electrically connected with a performance board having signal pads; and a pogo module having pogo pins for electrically connecting the signal pads of the probe card with the signal pads of the performance board during a test process, wherein at least two the pogo pins are electrically connected in parallel to one of the signal pads of the probe card, and wherein at least two pogo pins are electrically connected in parallel to one of the signal pads of the performance board. A resistance caused by the pogo pins is lowered to test the electrical characteristics of a semiconductor workpiece more precisely and a test process is performed even when one of the pogo pins is in poor contact with a pad.

Abstract: A method for testing a semiconductor device includes generating chip identification data for each of a plurality of devices under test to collect a plurality of chip identification data respectively corresponding to the plurality of devices under test. The plurality of chip identification data for the plurality of devices under test is transmitted responsive to collection thereof. The plurality of chip identification data may be received and written in parallel to the corresponding ones of the plurality of devices under test. Related apparatus are also discussed.

Abstract: An apparatus for testing electrical characteristics of a semiconductor workpiece includes a probe card having probes and signal pads electrically connected to the probes, wherein the probes are in contact with a workpiece during a test process; a test head electrically connected with a performance board having signal pads; and a pogo module having pogo pins for electrically connecting the signal pads of the probe card with the signal pads of the performance board during a test process, wherein at least two the pogo pins are electrically connected in parallel to one of the signal pads of the probe card, and wherein at least two pogo pins are electrically connected in parallel to one of the signal pads of the performance board. A resistance caused by the pogo pins is lowered to test the electrical characteristics of a semiconductor workpiece more precisely and a test process is performed even when one of the pogo pins is in poor contact with a pad.

Abstract: An apparatus for testing a semiconductor device includes: a power supplying unit for generating a voltage to be supplied to the semiconductor device under control of a test controller; a voltage transmitting unit for transmitting the voltage to the semiconductor device under control of the test controller; and an overcurrent detecting unit for detecting whether an overcurrent is supplied from an output of the power supplying unit, wherein the voltage transmitting unit cuts off a voltage supply to the semiconductor device in response to an output of the overcurrent detecting unit without intervention of the test controller.