Abstract: A semiconductor package including a package body which is uniquely configured to partially expose the semiconductor die of the package. The partial exposure of the semiconductor die enhances heat dissipation from the die. Additionally, the reduced amount of encapsulant material used in the fabrication of the semiconductor package attributable to only the partial encapsulation of the semiconductor die facilitates a reduction in the overall manufacturing cost related to the semiconductor package, and further allows one or more additional semiconductor packages to be stacked upon the package while still maintaining an overall profile of reduced thickness in the resultant stack.

Abstract: Semiconductor packages are disclosed. One semiconductor package includes a semiconductor die with an active surface, an opposite inactive surface, and four peripheral side surfaces. A substrate of the semiconductor package is coupled to one side surface of the semiconductor die. Bond pads of the active surface are coupled to a substrate first surface that is coplanar with the active surface. External interconnects, e.g., solder balls, are formed on a second substrate surface that is perpendicular to the active surface. An insulating layer, e.g., an encapsulant, together covers the active surface and the substrate first surface. An alternative semiconductor package includes two substrates, each attached to a respective one of two opposed side surfaces of the semiconductor die. The remaining two side surfaces of the semiconductor die are exposed. The external interconnects are formed on a third substrate surface that is coplanar with the inactive surface of the semiconductor die.