Patents by Inventor Byong Il HEO

Byong Il HEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20220246542
    Abstract: In one example, an electronic device structure includes a substrate having a conductive structure adjacent to a surface. The conductive structure can include a plurality of conductive traces. First and second electronic devices are disposed adjacent to the top surface. The first electronic device is interposed between a first conductive trace and a second conductive trace, and the second electronic device is interposed between the second conductive trace and a third conductive trace.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ji Young CHUNG, Jae Ho LEE, Byong Il HEO
  • Semiconductor device and method of manufacturing semiconductor device
    Patent number: 11342276
    Abstract: In one example, an electronic device structure includes a substrate having a conductive structure adjacent to a surface. The conductive structure can include a plurality of conductive pads. First and second electronic devices are disposed adjacent to the top surface. The first electronic device is interposed between a first conductive pad and a second conductive pad, and the second electronic device is interposed between the second conductive pad and a third conductive pad.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: May 24, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ji Young Chung, Jae Ho Lee, Byong Il Heo
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20200373247
    Abstract: In one example, an electronic device structure includes a substrate having a conductive structure adjacent to a surface. The conductive structure can include a plurality of conductive pads. First and second electronic devices are disposed adjacent to the top surface. The first electronic device is interposed between a first conductive pad and a second conductive pad, and the second electronic device is interposed between the second conductive pad and a third conductive pad.
    Type: Application
    Filed: May 24, 2019
    Publication date: November 26, 2020
    Applicant: Amkor Technology Korea, Inc.
    Inventors: Ji Young CHUNG, Jae Ho LEE, Byong Il HEO