Abstract: Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.

Abstract: A radio receiving apparatus deterioration of a receiving sensitivity of an antenna used in the radio receiving apparatus due to noise generated from a circuit board disposed within the radio receiving apparatus. The radio receiving apparatus includes a body, a printed circuit board provided within the body, an antenna provided at an area outside of the body and adapted to receive an external signal, and a noise attenuation member provided at the printed circuit board and adapted to attenuate noise generated from the printed circuit board, to prevent deterioration in the receiving sensitivity of the antenna.

Abstract: Disclosed is a probe of an electrical measuring instrument including a handle and at least one loop antenna coupled to the handle. A plane defined by the loop antenna is oriented to face an object to be inspected, to detect electrical characteristics in the vicinity of the object. Enhanced accessibility of the probe with respect to the object to be inspected results in an improvement in the accuracy of measured electrical characteristics information and use convenience of the probe by an inspector.

Abstract: Provided is a structure for reducing an impedance-discontinuity in a flexible printed circuit of a hard disk drive. The structure includes an actuator arm, a bracket, a flexible printed circuit having one end installed at the actuator arm and an other end installed at the bracket and including various circuits, and a metal member facing the flexible printed circuit and having one end installed at the actuator arm and an other end installed at the bracket.

Abstract: Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.

Abstract: A radio receiving apparatus deterioration of a receiving sensitivity of an antenna used in the radio receiving apparatus due to noise generated from a circuit board disposed within the radio receiving apparatus. The radio receiving apparatus includes a body, a printed circuit board provided within the body, an antenna provided at an area outside of the body and adapted to receive an external signal, and a noise attenuation member provided at the printed circuit board and adapted to attenuate noise generated from the printed circuit board, to prevent deterioration in the receiving sensitivity of the antenna.

Abstract: Provided is a structure for reducing an impedance-discontinuity in a flexible printed circuit of a hard disk drive. The structure includes an actuator arm, a bracket, a flexible printed circuit having one end installed at the actuator arm and an other end installed at the bracket and including various circuits, and a metal member facing the flexible printed circuit and having one end installed at the actuator arm and an other end installed at the bracket.

Abstract: A chip package includes a flat plate body or carrier with a plurality of leads embedded therein but exposed at the first and second surfaces, e.g., the top and bottom surfaces, of the plate body. The body has a predetermined shape and may include a recess formed in the upper surface of the body to a prescribed depth. A semiconductor chip is mounted on the upper surface of the plate body or carrier. Metallic bonding wires electrically connect the leads of the body with the bonding pads of the chip, and an epoxy molding compound seals a predetermined portion including the chip, the leads, and the metallic wires. A plurality of like chip packages may be vertically stacked. Instead of epoxy molding, a thin lid having leads similarly embedded therein may be attached to the upper surface of the body.