Abstract: A non-volatile memory device having an asymmetric channel structure is provided.

Abstract: A nonvolatile memory cell array having common drain lines and method of operating the same are disclosed. A positive voltage is applied to a gate of a selected cell and gates of memory cells that share a word line with the selected cell. A first voltage is applied to a drain of the selected cell and drains of the memory cells that share at least a drain line with the selected cell. A second voltage is applied to a source of the selected cell and sources of memory cells that share a bit line with the selected cell, the second voltage being less than the first voltage, such that electrons are injected into the charge storage region of the selected cell to program. A third voltage, which is higher than the second voltage, is applied to bit lines that are not connected to the selected cell.

Abstract: A programming method of a non-volatile memory device includes a pre-program of the non-volatile memory device, and a main-program of the pre-programmed non-volatile memory device. The non-volatile memory device may include a tunnel dielectric layer, a charge storage layer, a blocking dielectric layer, and a gate electrode, which are sequentially stacked on a semiconductor substrate. The charge storage layer may be an electrically-floated conductive layer, or a dielectric layer having a trap site. By performing a main-program after performing a pre-program, to increase the threshold voltage of the non-volatile memory device, the program current can be effectively reduced.

Abstract: A method of manufacturing a bipolar device including pre-treatment using germane gas and a bipolar device manufactured by the same. The method includes forming a single crystalline silicon layer for a base region on a collector region; and forming a polysilicon layer for an emitter region thereon. Here, before the polysilicon layer is formed, the single crystalline silicon layer is pre-treated using germane gas. Thus, an oxide layer is removed from the single crystalline silicon layer, and a germanium layer is formed on the single crystalline silicon layer, thus preventing Si-rearrangement.

Abstract: Provided are a nonvolatile memory device that has enhanced endurance and can accurately read stored data, and a method of manufacturing the same. The nonvolatile memory device includes a trench formed in a semiconductor substrate, a gate electrode formed in the trench, a gate electrode insulating layer interposed between the gate electrode and bottom and lower sidewalls of the trench, a trap structure interposed between upper sidewalls of the trench and the gate electrode and comprising a tunneling layer, a trapping layer, and a blocking layer, and source and drain regions formed on both sides of the semiconductor substrate with respect to the trench, in which the gate electrode insulating layer is not formed and partially overlapped by the trapping layer.

Abstract: A non-volatile memory device having an asymmetric channel structure is provided.

Abstract: A nonvolatile memory cell array having common drain lines and method of operating the same are disclosed. A positive voltage is applied to a gate of a selected cell and gates of memory cells that share a word line with the selected cell. A first voltage is applied to a drain of the selected cell and drains of the memory cells that share at least a drain line with the selected cell. A second voltage is applied to a source of the selected cell and sources of memory cells that share a bit line with the selected cell, the second voltage being less than the first voltage, such that electrons are injected into the charge storage region of the selected cell to program. A third voltage, which is higher than the second voltage, is applied to bit lines that are not connected to the selected cell.

Abstract: A programming method of a non-volatile memory device includes a pre-program of the non-volatile memory device, and a main-program of the pre-programmed non-volatile memory device. The non-volatile memory device may include a tunnel dielectric layer, a charge storage layer, a blocking dielectric layer, and a gate electrode, which are sequentially stacked on a semiconductor substrate. The charge storage layer may be an electrically-floated conductive layer, or a dielectric layer having a trap site. By performing a main-program after performing a pre-program, to increase the threshold voltage of the non-volatile memory device, the program current can be effectively reduced.

Abstract: Methods of preparing improved semiconductor substrates having gate oxide layers formed thereon, and use of such substrates in fabricating improved semiconductor devices, are disclosed.

Abstract: A nonvolatile memory cell employing a plurality of dielectric nanoclusters and a method of fabricating the same are disclosed. In one embodiment, the nonvolatile memory cell comprises a semiconductor substrate having a channel region. A control gate is disposed above the channel region. A control gate dielectric layer is disposed between the channel region and the control gate. A plurality of dielectric nanoclusters are disposed between the channel region and the control gate dielectric layer. Each nanocluster may be separated from adjacent nanoclusters by the control gate dielectric layer. A tunnel oxide layer is disposed between the plurality of dielectric nanoclusters and the channel region. Further, a source and a drain are formed in the semiconductor substrate.

Abstract: A method of manufacturing a bipolar device including pre-treatment using germane gas and a bipolar device manufactured by the same. The method includes forming a single crystalline silicon layer for a base region on a collector region; and forming a polysilicon layer for an emitter region thereon. Here, before the polysilicon layer is formed, the single crystalline silicon layer is pre-treated using germane gas. Thus, an oxide layer is removed from the single crystalline silicon layer, and a germanium layer is formed on the single crystalline silicon layer, thus preventing Si-rearrangement.

Abstract: Methods of preparing improved semiconductor substrates having gate oxide layers formed thereon, and use of such substrates in fabricating improved semiconductor devices, are disclosed.