Abstract: A furnace includes a chamber extended in a first direction to accommodate a plurality of substrates, a process plate on which the substrates are mounted, and the process plate is disposed in the chamber and extended in the first direction. The process plate includes a plurality of thru-holes penetrating through an upper surface and a lower surface of the process plate. The furnace further includes at least one fan disposed under the lower surface to flow air in the chamber in a second direction such that the air flows from the upper surface to the lower surface through the thru-holes and a heater operatively connected to the chamber to heat the air in the chamber.

Abstract: A method of manufacturing a solar cell is presented. The manufacturing method of a solar cell may include: forming a first electrode on a substrate; forming a precursor that includes copper, gallium, and indium on a first electrode, forming a preliminary light absorption layer by providing selenium Se to the precursor, forming a light absorption layer by providing a compound including at least one of gallium and indium to the preliminary light absorption layer, and forming a second electrode on the light absorption layer.

Abstract: A solar cell manufacturing method is provided. A solar cell manufacturing method according to an exemplary embodiment of the present invention includes: forming a first electrode on a substrate, forming a precursor including copper (Cu), gallium (Ga), and indium (In) on the first electrode, supplying selenium (Se) to the precursor to form a preliminary light absorption layer, depositing at least one of gallium or indium on the preliminary light absorption layer, supplying selenium (Se) to the preliminary light absorption layer deposited with the at least one of gallium and indium to form a light absorption layer and forming a second electrode on the light absorption layer.

Abstract: Provided are a solar cell and a method of fabricating the same. The solar cell includes: a substrate; a rear electrode layer which is formed on the substrate and includes molybdenum (Mo); a protective layer which is formed on the rear electrode layer and includes silicon (Si); a light-absorbing layer which is formed on the protective layer and includes selenium (Se) and at least one of copper (Cu), gallium (Ga), and indium (In); and a transparent electrode layer formed on the light-absorbing layer.

Abstract: A solar cell module is provided. The solar cell module includes: a substrate; a plurality of unit cells including a first electrode, a semiconductor layer, and a second electrode that are sequentially deposited on the substrate; a first sub-module and a second sub-module having the unit cells, respectively; a first longitudinal pattern dividing the unit cells of the first sub-module, and a second longitudinal pattern dividing the unit cells of the second sub-module; a transverse pattern dividing the first sub-module and the second sub-module; and an insulating portion disposed near the transverse pattern, and insulating between the first sub-module and the second sub-module, wherein the unit cells of the first sub-module are connected in series through the first longitudinal pattern, the unit cells of the second sub-module are connected in series through the second longitudinal pattern, and the first sub-module and the second sub-module are connected in series through the transverse pattern.

Abstract: A solar cell and a method of fabricating the same are provided according to one or more embodiments. According to an embodiment, the solar cell includes a substrate, a back electrode layer formed on the substrate, a light absorbing layer formed on the back electrode layer, and a transparent electrode layer formed on the light absorbing layer, wherein the light absorbing layer is comprised of copper (Cu), gallium (Ga), indium (In), sulfur (S), and selenium (Se) and includes a first concentration region in which concentrations of sulfur (S) gradually decrease in the light absorbing layer going in a first direction from the back electrode layer to the transparent electrode layer.

Abstract: A nonvolatile memory device and a method of fabricating the same are disclosed. The method includes forming a tunnel oxide film and a conductive film for a floating gate on a semiconductor substrate; nitriding the top surface of the conductive film for a floating gate; oxidizing the nitrided top surface of the conductive film for a floating gate that is nitrided, forming an ONO film comprising a lower oxide film, a nitride film and an upper oxide film sequentially laminated on the surface-modified conductive film for a floating gate to complete formation of the dielectric film; and forming the conductive film for a control gate on the dielectric film.

Abstract: A method is provided for forming a titanium nitride layer in a metal-insulator-metal (MIM) capacitor. The deposition of a titanium nitride layer is carried out by means of an MOCVD method using a metallo-organic material as a source gas, followed by a rapid thermal process (RTP) at a high temperature. Through the RTP, impurities in the titanium nitride layer are removed and a surface area of the titanium nitride layer is increased in comparison with the titanium nitride layer before the RTP. The titanium nitride layer with increased surface area is useful for a lower electrode of a MIM capacitor.