Patents by Inventor Byoung-Gug MIN
Byoung-Gug MIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11862571Abstract: A semiconductor package including a first semiconductor chip having an upper surface, a lower surface that is opposite to the upper surface, and a sidewall between the upper surface and the lower surface; a capping insulation layer covering the upper surface and the sidewall of the first semiconductor chip; and a shielding layer on the capping insulation layer, wherein a lower portion of the capping insulation layer includes a laterally protruding capping protrusion contacting a lower surface of the shielding layer.Type: GrantFiled: March 14, 2022Date of Patent: January 2, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung-Gug Min, Younhee Kang, Min-Woo Song
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Publication number: 20220199549Abstract: A semiconductor package including a first semiconductor chip having an upper surface, a lower surface that is opposite to the upper surface, and a sidewall between the upper surface and the lower surface; a capping insulation layer covering the upper surface and the sidewall of the first semiconductor chip; and a shielding layer on the capping insulation layer, wherein a lower portion of the capping insulation layer includes a laterally protruding capping protrusion contacting a lower surface of the shielding layer.Type: ApplicationFiled: March 14, 2022Publication date: June 23, 2022Inventors: Byoung-Gug MIN, Younhee KANG, Min-Woo SONG
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Patent number: 11296037Abstract: A semiconductor package including a first semiconductor chip having an upper surface, a lower surface that is opposite to the upper surface, and a sidewall between the upper surface and the lower surface; a capping insulation layer covering the upper surface and the sidewall of the first semiconductor chip; and a shielding layer on the capping insulation layer, wherein a lower portion of the capping insulation layer includes a laterally protruding capping protrusion contacting a lower surface of the shielding layer.Type: GrantFiled: October 30, 2019Date of Patent: April 5, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung-Gug Min, Younhee Kang, Min-Woo Song
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Patent number: 11011473Abstract: Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a molding layer on the substrate covering the semiconductor chip, and a shield layer on the molding layer. The shield layer includes a polymer in which a plurality of conductive structures and a plurality of nano-structures are distributed wherein at least some of the conductive structures are connected to one another.Type: GrantFiled: July 23, 2019Date of Patent: May 18, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Younhee Kang, Byoung-Gug Min, Shi-Kyung Kim, Min-Woo Song, Jae-Seon Hwang
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Publication number: 20200312783Abstract: A semiconductor package including a first semiconductor chip having an upper surface, a lower surface that is opposite to the upper surface, and a sidewall between the upper surface and the lower surface; a capping insulation layer covering the upper surface and the sidewall of the first semiconductor chip; and a shielding layer on the capping insulation layer, wherein a lower portion of the capping insulation layer includes a laterally protruding capping protrusion contacting a lower surface of the shielding layer.Type: ApplicationFiled: October 30, 2019Publication date: October 1, 2020Inventors: Byoung-Gug MIN, Younhee KANG, Min-Woo SONG
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Publication number: 20200194380Abstract: Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a molding layer on the substrate covering the semiconductor chip, and a shield layer on the molding layer. The shield layer includes a polymer in which a plurality of conductive structures and a plurality of nano-structures are distributed wherein at least some of the conductive structures are connected to one another.Type: ApplicationFiled: July 23, 2019Publication date: June 18, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Younhee Kang, Byoung-Gug Min, Shi-Kyung Kim, Min-Woo Song, Jae-Seon Hwang
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Patent number: 10410974Abstract: Semiconductor packages and a methods for manufacturing a semiconductor package are provided. The method includes providing a package including a substrate, a semiconductor chip provided on the substrate, and a molding layer provided on the substrate and covering the semiconductor chip, the substrate including a ground pattern exposed at one surface of the substrate; and applying a solution including metal particles and a conductive carbon material onto the molding layer to form a shielding layer covering the molding layer. The shielding layer includes the metal particles and the conductive carbon material connected to at least one of the metal particles. The shielding layer extends onto the one surface of the substrate and is electrically connected to the ground pattern.Type: GrantFiled: November 19, 2018Date of Patent: September 10, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung-Gug Min, Sungil Cho, Jaehoon Choi, Shi-kyung Kim
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Publication number: 20190109095Abstract: Semiconductor packages and a methods for manufacturing a semiconductor package are provided. The method includes providing a package including a substrate, a semiconductor chip provided on the substrate, and a molding layer provided on the substrate and covering the semiconductor chip, the substrate including a ground pattern exposed at one surface of the substrate; and applying a solution including metal particles and a conductive carbon material onto the molding layer to form a shielding layer covering the molding layer. The shielding layer includes the metal particles and the conductive carbon material connected to at least one of the metal particles. The shielding layer extends onto the one surface of the substrate and is electrically connected to the ground pattern.Type: ApplicationFiled: November 19, 2018Publication date: April 11, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung-Gug Min, Sungil Cho, Jaehoon Choi, Shi-kyung Kim
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Patent number: 10177096Abstract: Semiconductor packages and a methods for manufacturing a semiconductor package are provided. The method includes providing a package including a substrate, a semiconductor chip provided on the substrate, and a molding layer provided on the substrate and covering the semiconductor chip, the substrate including a ground pattern exposed at one surface of the substrate; and applying a solution including metal particles and a conductive carbon material onto the molding layer to form a shielding layer covering the molding layer. The shielding layer includes the metal particles and the conductive carbon material connected to at least one of the metal particles. The shielding layer extends onto the one surface of the substrate and is electrically connected to the ground pattern.Type: GrantFiled: June 14, 2017Date of Patent: January 8, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung-Gug Min, Sungil Cho, Jaehoon Choi, Shi-kyung Kim
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Publication number: 20170358540Abstract: Semiconductor packages and a methods for manufacturing a semiconductor package are provided. The method includes providing a package including a substrate, a semiconductor chip provided on the substrate, and a molding layer provided on the substrate and covering the semiconductor chip, the substrate including a ground pattern exposed at one surface of the substrate; and applying a solution including metal particles and a conductive carbon material onto the molding layer to form a shielding layer covering the molding layer. The shielding layer includes the metal particles and the conductive carbon material connected to at least one of the metal particles. The shielding layer extends onto the one surface of the substrate and is electrically connected to the ground pattern.Type: ApplicationFiled: June 14, 2017Publication date: December 14, 2017Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung-Gug MIN, Sungil CHO, Jaehoon CHOI, Shi-kyung KIM