Patents by Inventor Byoung-Il Kim

Byoung-Il Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12006429
    Abstract: The present invention provides a thermoplastic resin composition which includes: a first copolymer including a core including a conjugated diene-based polymer and a shell including an aromatic vinyl-based monomer unit and a vinyl cyan-based monomer unit; and a second copolymer including an aromatic vinyl-based monomer unit and a vinyl cyan-based monomer unit, wherein the first copolymer has a degree of grafting of 32 to 50%, the second copolymer has a weight-average molecular weight of 85,000 to 115,000 g/mol, and the thermoplastic resin composition includes the first copolymer at 30 wt % or less and an oligomer residue at 1.1 wt % or less. Specifically, the thermoplastic resin composition can shorten an injection molding time.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 11, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Seo Hwa Kim, Byoung Il Kang, Eun Jung Choi, Taek Jun Jung, Jeong In Cho, Dong Kun Shin
  • Patent number: 11994309
    Abstract: An air conditioner includes an outdoor unit, a plurality of mode change devices including at least one mode changer including a branch duct and a changing valve, and configured to receive a control signal from the outdoor unit to control an operation of the at least one mode changer. A plurality of indoor units are connected to the outdoor unit or the plurality of mode change devices. The outdoor unit may determine an operation mode to operate the plurality of mode change devices a plurality of times. Each of the plurality of indoor units may detect a temperature change of an indoor heat exchanger in response to the operation of the mode change devices, to determine the number of connected mode changers and a connectable mode changer candidate group based on the temperature change of the indoor heat exchanger.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: May 28, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong Won Bak, Tae Il Kim, Dong-Il Jung, Dong Hyun Goh, Hyeong Joon Seo, Suk Ho Lee, Byoung Guk Lee, Hyeong Seok Lim, Yong Hee Jang
  • Publication number: 20240170864
    Abstract: A plug connector coupled to a receptacle connector is presented, comprising: a conductor for signals; a ring-shaped conductor for ground, the conductor for ground surrounding the conductor for signals; a ring-shaped insulator surrounding the conductor for signals and being surrounded by the conductor for ground, and insulating between the conductor for signals and the conductor for ground; a lower body; and an upper body coupled onto the lower body. The conductor for signals includes a lower portion protruding below a first portion of the top of the insulator, a middle portion inserted into a hollow portion of the first portion, and an upper portion protruding above the first portion. The conductor for ground includes a lower portion protruding below the first portion and an upper portion surrounding the first portion. The lower body includes a lower housing, such that the upper portion is accommodated in the hollow portion.
    Type: Application
    Filed: March 3, 2022
    Publication date: May 23, 2024
    Applicants: SENSORVIEW CO., LTD., OKINS ELECTRONICS CO., LTD
    Inventors: Byoung Nam KIM, Kyoung Il KANG, Joung Min PARK, Sung Cheol CHO, Jin Kook JUN, Sung Gyu PARK, Soeung Chel JANG
  • Patent number: 11967492
    Abstract: The present disclosure relates to a thin film manufacturing apparatus including a chamber having an inner process space of a substrate, a substrate support unit connected to the chamber to support the substrate in the chamber, a heat source unit connected to the chamber and disposed opposite to the substrate support unit, a plasma generation unit connected to one side of the chamber to supply radicals between the substrate support unit and the heat source unit, and a baffle connected to the chamber and including a movement passage of the radicals therein and a plurality of first exhaust holes communicating with the movement passage, which are formed in a top surface thereof. The thin film manufacturing apparatus may improve uniformity of the thin film formed on the substrate.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: April 23, 2024
    Assignee: AP SYSTEMS INC.
    Inventors: Byoung Il Lee, Chang Kyo Kim, Chang Min Kwon, Seung Won Yu
  • Publication number: 20240118036
    Abstract: A vapor chamber comprises a front surface member having a curvature, a rear surface member coupled to the front surface member, a wick disposed between the front surface member and the rear surface member, and a refrigerant at least partially filled between the front surface member and the rear surface member, wherein the rear surface member includes a plurality of bent areas.
    Type: Application
    Filed: July 20, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Wee Joon JEONG, Yong Il KIM, Byoung Kyoo PARK, Jang Un CHOI
  • Patent number: 10676653
    Abstract: The present invention relates to an adhesive comprising an anti-insect ingredient comprising a plant extract, wherein the plant extract comprises an extract of Cinnamomum cassia, an extract of Syzygium aromaticum and an extract of Artemisia capillaris and an adhesive ingredient comprising a binder. The adhesive is environment friendly and does not have any toxic ingredient on a human body and exhibit excellent and synergic anti-insect efficiency by using three plant extracts. Therefore, it is possible to control pests that may have an adverse effect on foods by applying the adhesive to a food package box.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: June 9, 2020
    Assignee: NONGSHIM CO., LTD
    Inventors: Byoung Il Kim, Young Jin Lee, Jong Bae Byun, Ja Hyun Na
  • Publication number: 20200017733
    Abstract: The present invention relates to an adhesive comprising an anti-insect ingredient comprising a plant extract, wherein the plant extract comprises an extract of Cinnamomum cassia, an extract of Syzygium aromaticum and an extract of Artemisia capillaris and an adhesive ingredient comprising a binder. The adhesive is environment friendly and does not have any toxic ingredient on a human body and exhibit excellent and synergic anti-insect efficiency by using three plant extracts. Therefore, it is possible to control pests that may have an adverse effect on foods by applying the adhesive to a food package box.
    Type: Application
    Filed: July 11, 2018
    Publication date: January 16, 2020
    Inventors: Byoung Il KIM, Young Jin LEE, Jong Bae BYUN, Ja Hyun NA
  • Patent number: 9258539
    Abstract: An image capture device and a method of calibrating automatic white balance thereof are provided. The method includes generating first and second frame data using first and second image sensors, respectively, in response to incident light; generating first and second color temperature estimation information based on the first frame data and the second frame data, respectively; determining whether an amount of the first color temperature estimation information is sufficient to estimate a color temperature of a light source; estimating the color temperature of the light source based on the first color temperature estimation information when the amount of the first color temperature estimation information is sufficient; and when the amount of the first color temperature estimation information is insufficient estimating the color temperature of the light source based on the first and second color temperature estimation information; and adjusting the first frame data based on the estimated color temperature.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: February 9, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Byoung-Il Kim
  • Publication number: 20040162720
    Abstract: An apparatus and method for encoding audio data with a small amount of computation are provided. The audio data encoding apparatus includes: a time-to-frequency converting unit that receives a time domain audio signal and converts the same to a frequency domain audio signal; a spectral processor that performs spectral processing on the frequency domain audio signal; a masking threshold calculator that calculates an energy level for each frequency band of the frequency domain audio signal, approximates an energy distribution curve connecting the calculated energy levels to a distribution pattern similar to that of noise threshold levels calculated by a conventional psychoacoustic model, and calculates a scalefactor band gain for each band; and a quantization noise curve adjuster that adjusts a common gain to meet a target bit rate and matches a quantization noise curve to the approximated energy distribution curve while fixing the scalefactor gain for each frequency band.
    Type: Application
    Filed: December 3, 2003
    Publication date: August 19, 2004
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Heung-Yeop Jang, Byoung-Il Kim, Tae-Gyu Chang