Abstract: Disclosed are a memory system for a data swap and an operating method thereof. A memory system may include a plurality of layers coupled through at least one through silicon via (TSV) channel and a swap controller configured to generate a swap control command in response to a request received from an external host and to device swap data into a plurality of data units having a predetermined size to perform a swap operation between a first layer and a second layer among the plurality of layers, wherein the first layer and the second layer include at least one swap buffer and control a movement of the plurality of data units in response to the swap control command.

Abstract: A semiconductor package has a substrate comprising a resin layer of an approximate planar plate, a die pad coupled at a top surface of a center area of the resin layer and having a printed photo imaging type protective layer thereon and a plurality of electrically conductive patterns, on which the photo imaging type protective layer and a thermosetting protective layer are printed in a consecutive order, formed at a periphery of the die pad. A semiconductor die is coupled to the photo imaging type protective layer on the die pad of the substrate by an adhesive. A plurality of conductive wires is used for electrically connecting the semiconductor die to the electrically conductive patterns. An encapsulant is used for covering the semiconductor die, the conductive wires and the surface of thermosetting protective layer on the electrically conductive patterns in order to protect them from the external environment. A plurality of contacts are coupled to the electrically conductive patterns of the substrate.

Abstract: A test device for testing a plurality of Digital Signal Processor Integrated Circuits Incorporated as a finished product in a digital video apparatus comprises: a plurality of Digital Signal Processor Integrated Circuits (DSP ICs) for processing a signal from a test signal generator as a digital signal and outputting the digitally processed signal, the test signal generator being disposed at an input end of the plurality of DSP ICs; a monitor for monitoring an output from the DSP IC being tested. It is possible to check in a simple manner the operating state of each IC connected to other DSP ICs as well as the production and assembly state of the PCB as a finished digital video apparatus. Furthermore, it is possible to check for damage of the parts or an error which may be generated during connection of the ICs to the lines on the PCB in the manufacturing of the products as well as defects caused during shipping of assembled IC components in a DSP apparatus.

Abstract: The present invention relates to an envelope signal generator for electronic musical instruments, and more particularly to an envelope signal generator that generates natural envelopes from which digital noises are removed substantially by obtaining a difference between a current value and a targeted value and then generating a corresponding value for compensating the difference.