Abstract: In a non-volatile memory device with a buried control gate, the effective channel length of the control gate is increased to restrain punchthrough, and a region for storing charge is increased for attaining favorably large capacity. A method of fabricating the memory device includes forming the control gate within a trench formed in a semiconductor substrate, and forming charge storing regions in the semiconductor substrate on both sides of the control gate in a self-aligning manner, thereby allowing for multi-level cell operation.

Abstract: A non-volatile memory device includes a pair of source/drain regions disposed in a semiconductor substrate, having a channel region between them. A charge storage oxide layer is disposed on the channel region and overlaps part of each of the pair of source/drain regions. A gate electrode is disposed on the charge storage oxide layer. At least one halo implantation region is formed in the semiconductor substrate adjacent to one of the pair of source/drain regions, and overlapping the charge storage oxide layer. A program operation is performed by trapping electrons in the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed, and an erase operation is performed by injecting holes into the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed.

Abstract: Erasure methods for a nonvolatile memory cell that includes a gate electrode on a substrate, source and drain regions in the substrate at respective sides of the gate electrode, and a charge storage layer interposed between the gate electrode and the substrate. A nonzero first voltage is applied to the source region starting at a first time. While continuing to apply the first nonzero voltage to the source region, a second voltage having an opposite polarity to the first voltage is applied to the gate electrode starting at a second time later than the first time. The second voltage may increase in magnitude, e.g., stepwise, linearly and/or along a curve, after the second time.

Abstract: A nonvolatile memory device and method thereof are provided. The example method may include applying a first bias voltage to a gate electrode, applying a second bias voltage to a substrate to obtain a first voltage potential difference between the gate electrode and the substrate and applying a third bias voltage to a first impurity region to obtain a second voltage potential difference between the substrate and the first impurity region, the first and third bias voltages being positive and the second bias voltage being negative.

Abstract: A nonvolatile memory cell array having common drain lines and method of operating the same are disclosed. A positive voltage is applied to a gate of a selected cell and gates of memory cells that share a word line with the selected cell. A first voltage is applied to a drain of the selected cell and drains of the memory cells that share at least a drain line with the selected cell. A second voltage is applied to a source of the selected cell and sources of memory cells that share a bit line with the selected cell, the second voltage being less than the first voltage, such that electrons are injected into the charge storage region of the selected cell to program. A third voltage, which is higher than the second voltage, is applied to bit lines that are not connected to the selected cell.

Abstract: Erasure methods are provided for a nonvolatile memory cell that includes a gate electrode on a substrate, source and drain regions in the substrate at respective sides of the gate electrode, and a charge storage layer interposed between the gate electrode and the substrate. A nonzero first voltage is applied to the source region starting at a first time. While continuing to apply the first nonzero voltage to the source region, a second voltage having an opposite polarity to the first voltage is applied to the gate electrode starting at a second time later than the first time. The second voltage may increase in magnitude, e.g., stepwise, linearly and/or along a curve, after the second time.

Abstract: In a non-volatile memory device with a buried control gate, the effective channel length of the control gate is increased to restrain punchthrough, and a region for storing charge is increased for attaining favorably large capacity. A method of fabricating the memory device includes forming the control gate within a trench formed in a semiconductor substrate, and forming charge storing regions in the semiconductor substrate on both sides of the control gate in a self-aligning manner, thereby allowing for multi-level cell operation.

Abstract: Provided are a nonvolatile memory device that has enhanced endurance and can accurately read stored data, and a method of manufacturing the same. The nonvolatile memory device includes a trench formed in a semiconductor substrate, a gate electrode formed in the trench, a gate electrode insulating layer interposed between the gate electrode and bottom and lower sidewalls of the trench, a trap structure interposed between upper sidewalls of the trench and the gate electrode and comprising a tunneling layer, a trapping layer, and a blocking layer, and source and drain regions formed on both sides of the semiconductor substrate with respect to the trench, in which the gate electrode insulating layer is not formed and partially overlapped by the trapping layer.

Abstract: In an embodiment, a spinning apparatus includes a spin table on which an object to be etched is placed, a rotation unit rotating the spin table, and a nozzle unit including a center nozzle, disposed on the central portion of the spin table, and at least one side nozzle, disposed on an edge of the spin table. Etching uniformity is improved over the conventional art because an etching chemical is distributed more evenly by the nozzle unit as the object to be etched is rotated. An embodiment may also include an exhaust to remove excess etching chemical.

Abstract: A non-volatile memory device having improved electrical characteristics and a method of fabricating the non-volatile memory device are provided. The non-volatile memory device includes a gate electrode, which is formed on a semiconductor substrate on which source and drain regions are formed, a trapping structure, which is interposed between the semiconductor substrate and the gate electrode and comprises an electron tunneling layer and a charge trapping layer, and an electron back-tunneling prevention layer, which is interposed between the gate electrode and the charge trapping layer, prevents electrons in the gate electrode from back-tunneling through the charge trapping layer, and is formed of a metal having a higher work function than the gate electrode.

Abstract: A non-volatile memory device having an asymmetric channel structure is provided.

Abstract: A non-volatile memory device includes a pair of source/drain regions disposed in a semiconductor substrate, having a channel region between them. A charge storage oxide layer is disposed on the channel region and overlaps part of each of the pair of source/drain regions. A gate electrode is disposed on the charge storage oxide layer. At least one halo implantation region is formed in the semiconductor substrate adjacent to one of the pair of source/drain regions, and overlapping the charge storage oxide layer. A program operation is performed by trapping electrons in the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed, and an erase operation is performed by injecting holes into the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed.

Abstract: A nonvolatile memory cell array having common drain lines and method of operating the same are disclosed. A positive voltage is applied to a gate of a selected cell and gates of memory cells that share a word line with the selected cell. A first voltage is applied to a drain of the selected cell and drains of the memory cells that share at least a drain line with the selected cell. A second voltage is applied to a source of the selected cell and sources of memory cells that share a bit line with the selected cell, the second voltage being less than the first voltage, such that electrons are injected into the charge storage region of the selected cell to program. A third voltage, which is higher than the second voltage, is applied to bit lines that are not connected to the selected cell.

Abstract: A nonvolatile memory cell employing a plurality of dielectric nanoclusters and a method of fabricating the same are disclosed. In one embodiment, the nonvolatile memory cell comprises a semiconductor substrate having a channel region. A control gate is disposed above the channel region. A control gate dielectric layer is disposed between the channel region and the control gate. A plurality of dielectric nanoclusters are disposed between the channel region and the control gate dielectric layer. Each nanocluster may be separated from adjacent nanoclusters by the control gate dielectric layer. A tunnel oxide layer is disposed between the plurality of dielectric nanoclusters and the channel region. Further, a source and a drain are formed in the semiconductor substrate.