Abstract: This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.

Abstract: This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.

Abstract: An array for a display device is formed by adhering a positive dry film resist, which has a positive photoresist resin layer over a supporting film, to a substrate such that the photoresist resin layer adheres on a surface of the substrate. The supporting film is then released from the photoresist resin layer adhered to the surface of the substrate, the layer is exposed to light; and the positive type photoresist layer is developed to remove exposed regions.

Abstract: Disclosed are a composition for positive type photoresist and a positive type photoresist film manufactured thereby. The composition comprises an alkali soluble resin, a photosensitive compound, a thermo-curable cross linking agent, a sensitivity enhancer and a solvent. The photoresist film has a supporting film and a photoresist layer formed on the supporting film, wherein the photoresist layer comprises the alkali soluble resin, the photosensitive compound, the thermo-curable cross linking agent and the sensitivity enhancer.

Abstract: A positive type photoresist resin film includes a support film and a thermosetting positive type photoresist resin layer laminated over the support film. The positive type photoresist resin layer contains alkali soluble resin, a diazide based photosensitive compound and a sensitivity enhancer. The support film has a surface roughness that inhibits the formation of defect structures such as fish eye. The invention overcomes process inefficiencies and defects cause by spin coating photoresist technologies.

Abstract: A positive type photoresist resin film contains a support film and a positive photoresist resin layer laminated over the support film. The peak height (Rp) of the support film is less than about 300 nm to eliminate fish eye defects. The positive photoresist resin layer may contain alkali soluble resin, a diazide based photosensitive compound, a plasticizer and, optionally, a sensitivity enhancer and a releasing agent.

Abstract: Disclosed are a composition for positive type photoresist and a positive type photoresist film manufactured thereby. The composition comprises an alkali soluble resin, a photosensitive compound, a thermo-curable cross linking agent, a sensitivity enhancer and a solvent. The photoresist film has a supporting film and a photoresist layer formed on the supporting film, wherein the photoresist layer comprises the alkali soluble resin, the photosensitive compound, the thermo-curable cross linking agent and the sensitivity enhancer.

Abstract: A positive type photoresist resin film contains a support film and a positive photoresist resin layer laminated over the support film. The photoresist layer may be formed from a composition containing a resin, a photosensitive compound, and a first solvent having a boiling point sufficiently high such that a second solvent can be removed from the composition by heating while the first solvent is substantially retained in the composition.

Abstract: An array for a display device is formed by adhering a positive dry film resist, which has a positive photoresist resin layer over a supporting film, to a substrate such that the photoresist resin layer adheres on a surface of the substrate. The supporting film is then released from the photoresist resin layer adhered to the surface of the substrate, the layer is exposed to light; and the positive type photoresist layer is developed to remove exposed regions.

Abstract: A positive type photoresist resin film contains a support film and a positive photoresist resin layer laminated over the support film. The peak height (Rp) of the support film is less than about 300 nm to eliminate fish eye defects. The positive photoresist resin layer may contain alkali soluble resin, a diazide based photosensitive compound, a plasticizer and, optionally, a sensitivity enhancer and a releasing agent.

Abstract: A positive type photoresist resin film includes a support film and a thermosetting positive type photoresist resin layer laminated over the support film. The positive type photoresist resin layer contains alkali soluble resin, a diazide based photosensitive compound and a sensitivity enhancer. The support film has a surface roughness that inhibits the formation of defect structures such as fish eye. The invention overcomes process inefficiencies and defects cause by spin coating photoresist technologies.

Abstract: Any one of a Ti-containing water-soluble salt, metatitanic acid (TiO(OH)2) slurry and ultra fine titanium oxide powder, and a transition metal containing metal salt are dissolved in water to prepare a raw material mixture. The raw material is spray-dried to obtain precursor powder, which is calcined to form ultra fine Ti/transition metal complex oxide and is then mixed with nano-sized carbon particles and subjected to reduction and carburization in a non-oxidizing atmosphere.

Abstract: Disclosed herein is a method for economically manufacturing high quality TiC powder, TiCN powder or ultrafine nanophase TiC+Ni (Co, Al) and TiCN+Ni (Co, Al) composite powders by means of metallothermic reduction. The method comprises the steps of preparing a starting solution of titanium tetrachloride (TiCl4) in a carbon chloride, feeding the starting solution into a closed container containing molten magnesium (Mg) under inert atmosphere, vacuum-separating unreacted liquid-phase Mg and magnesium chloride (MgCl2) remaining after reduction of magnesium from the closed container, and collecting a TiC compound from the closed container. TiC powder, TiCN powder or ultrafine nanophase TiC+Ni (Co, Al) and TiCN+Ni (Co, Al) composite powders having a particle size of a few tens nm can be manufactured in a simpler manner using economically advantageous starting materials such as titanium tetrachloride and carbon chlorides.

Abstract: Disclosed herein is a method for economically manufacturing high quality TiC powder, TiCN powder or ultrafine nanophase TiC+Ni (Co, Al) and TiCN+Ni (Co, Al) composite powders by means of metallothermic reduction. The method comprises the steps of preparing a starting solution of titanium tetrachloride (TiCl4) in a carbon chloride, feeding the starting solution into a closed container containing molten magnesium (Mg) under inert atmosphere, vacuum-separating unreacted liquid-phase Mg and magnesium chloride (MgCl2) remaining after reduction of magnesium from the closed container, and collecting a TiC compound from the closed container. TiC powder, TiCN powder or ultrafine nanophase TiC+Ni (Co, Al) and TiCN+Ni (Co, Al) composite powders having a particle size of a few tens nm can be manufactured in a simpler manner using economically advantageous starting materials such as titanium tetrachloride and carbon chlorides.

Abstract: The present invention relates to a method of producing W—Cu based composite powder, which is used in heat-sink materials for high-power integrated circuits, electric contact materials, etc, and to a method of producing a W—Cu based sintered alloy by using the composite powder. The method of producing tungsten-copper based composite powder includes first preparing composite oxide powder by dissolving ammonium metatungstate, [(NH4)6(H2W12O40).

Abstract: Any one of a Ti-containing water-soluble salt, metatitanic acid (TiO(OH)2) Slurry and ultra fine titanium oxide powder, and a transition metal containing metal salt are dissolved in water to prepare a raw material mixture. The raw material is spray-dried to obtain precursor powder, which is calcined to form ultra fine Ti/transition metal complex oxide and is then mixed with nano-sized carbon particles and subjected to reduction and carburization in a non-oxidizing atmosphere.

Abstract: Disclosed herein is a method for economically manufacturing high quality TiC powder, TiCN powder or ultrafine nanophase TiC+Ni (Co, Al) and TiCN+Ni (Co, Al) composite powders by means of metallothermic reduction. The method comprises the steps of preparing a starting solution of titanium tetrachloride (TiCl4) in a carbon chloride, feeding the starting solution into a closed container containing molten magnesium (Mg) under inert atmosphere, vacuum-separating unreacted liquid-phase Mg and magnesium chloride (MgCl2) remaining after reduction of magnesium from the closed container, and collecting a TiC compound from the closed container.

Abstract: The present invention relates to a method of producing W—Cu based composite powder, which is used in heat-sink materials for high-power integrated circuits, electric contact materials, etc, and to a method of producing a W—Cu based sintered alloy by using the composite powder. The method of producing tungsten-copper based composite powder includes first preparing composite oxide powder by dissolving ammonium metatungstate, [(NH4)6(H2W12O40).

Abstract: The present invention relates to a method of producing nanophase Cu—Al2O3 composite powder by means of 1) the producing precursor powders by centrifugal spray drying process using the water base solution, in which Cu-nitrate (Cu(NO3)23H2O) and Al-Nitrate (Al(NO3)39H2O) are solved to the point of final target composition (Cu-1 wt %/Al2O3),2) the heat treatment process (desaltation process) at the 850° C. for 30 min in air atmosphere to remove the volatile components such as the moisture and NO3 group in precursor powder and simultaneously to synthesize the nano CuO—Al2O3 composite powders by the oxidation of corresponded metal components and 3) the reduction heat treatment of CuO at 200° C. for 30 min in reducing atmosphere to produce the final nanophase Cu—Al2O3 composite powders with the size below 20 nm.

Abstract: The present invention relates to a method of adding a grain growth inhibitor of WC/Co cemented carbide, which comprises adding a water-soluble salt of V, Ta, or Cr component as a grain growth inhibitor, at the time of mixing water-soluble salts of W and Co during the initial production process of WC/Co cemented carbides. As a result, the present invention leads to the production of powder of homogeneous distribution of grain growth inhibitors, which in turn results in the enhancement of the mechanical properties thereof by effectively controlling the abnormal growth of WC during sintering in the production process of said cemented carbides.