Patents by Inventor Byoung Ki Pyo
Byoung Ki Pyo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9293677Abstract: The present invention relates to a light-emitting diode package having a plurality of inner leads, a plurality of outer leads extending from the inner leads, a slug electrically connected to at least one of the inner leads, the slug having a thermally conductive material, a light-emitting chip arranged on the slug, and a housing supporting the light-emitting diode package.Type: GrantFiled: November 22, 2011Date of Patent: March 22, 2016Assignee: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Jong Kook Lee, Byoung Ki Pyo, Hyuck Jung Choi, Kyung Nam Kim, Won Cho
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Patent number: 9236549Abstract: The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.Type: GrantFiled: December 18, 2007Date of Patent: January 12, 2016Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jong Kook Lee, Byoung Ki Pyo, Hyuck Jung Choi, Kyung Nam Kim, Won Cho
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Patent number: 8860049Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.Type: GrantFiled: April 20, 2011Date of Patent: October 14, 2014Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jung Hoo Seo, Do Hyung Kim, Byoung Ki Pyo, You Jin Kwon, Ju Yong Shim
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HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME
Publication number: 20120061717Abstract: The present invention relates to a light-emitting diode package having a plurality of inner leads, a plurality of outer leads extending from the inner leads, a slug electrically connected to at least one of the inner leads, the slug having a thermally conductive material, a light-emitting chip arranged on the slug, and a housing supporting the light-emitting diode package.Type: ApplicationFiled: November 22, 2011Publication date: March 15, 2012Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Jong Kook LEE, Byoung Ki PYO, Hyuck Jung CHOI, Kyung Nam KIM, Won CHO -
Patent number: 8053799Abstract: The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed.Type: GrantFiled: September 27, 2007Date of Patent: November 8, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: You Jin Kwon, Jung Hu Seo, Byoung Ki Pyo, Kang Hyun Cho
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Publication number: 20110193111Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.Type: ApplicationFiled: April 20, 2011Publication date: August 11, 2011Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Jung Hoo SEO, Do Hyung KIM, Byoung Ki PYO, You Jin KWON, Ju Yong SHIM
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Patent number: 7960744Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.Type: GrantFiled: June 30, 2008Date of Patent: June 14, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jung Hoo Seo, Do Hyung Kim, Byoung Ki Pyo, You Jin Kwon, Ju Yong Shim
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HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME
Publication number: 20100091504Abstract: The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.Type: ApplicationFiled: December 18, 2007Publication date: April 15, 2010Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Jong Kook Lee, Byoung Ki Pyo, Hyuck Jung Choi, Kyung Nam Kim, Won Cho -
Publication number: 20100072499Abstract: The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed.Type: ApplicationFiled: September 27, 2007Publication date: March 25, 2010Applicant: Seoul Semiconductor Co., Ltd.Inventors: You Jin Kwon, Jung Hu Seo, Byoung Ki Pyo, Kang Hyun Cho
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Publication number: 20090001393Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.Type: ApplicationFiled: June 30, 2008Publication date: January 1, 2009Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Jung Hoo SEO, Do Hyung KIM, Byoung Ki PYO, You Jin KWON, Ju Yong SHIM