Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 mum or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 mum.

Abstract: A copper foil for a current collector of a lithium secondary battery is configured such that a nodule cluster having an inter-nodule aspect ratio of 0.001 to 2 is provided at a matte side formed on one surface of the copper foil, in aspect of a crystal structure, a ratio of a texture coefficient of a (200) surface to a sum of texture coefficients of a (111) surface and the (200) surface is 30 to 80%, the copper foil has a water contact angle of 90 DEG or below, and impurity spots existing at the surface of the copper foil have a maximum diameter of 100 [mu]m or less, and a minimal spacing distance between the impurity spots is 1 cm or more.

Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 mum or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 mum.

Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 ?m or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 ?m.

Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 ?m or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 ?m.

Abstract: A copper foil for a current collector of a lithium secondary battery is configured such that a nodule cluster having an inter-nodule aspect ratio of 0.001 to 2 is provided at a matte side formed on one surface of the copper foil, in aspect of a crystal structure, a ratio of a texture coefficient of a (200) surface to a sum of texture coefficients of a (111) surface and the (200) surface is 30 to 80%, the copper foil has a water contact angle of 90° or below, and impurity spots existing at the surface of the copper foil have a maximum diameter of 100 ?m or less, and a minimal spacing distance between the impurity spots is 1 cm or more.

Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 ?m or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 ?m.

Abstract: A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Abstract: A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Abstract: A substrate for a superconducting wire is made of Ni or Ni alloy, with a ratio of cube texture of 95% or above constant in a width direction of a substrate body, a ratio of low-angle (15 or less) grain boundary of 99% or above regularly distributed in the width direction, a thickness of 40-150 ?m, an average grain size of 100 ?m or less, and a surface roughness of RMS 50 nm or less. A method for fabricating the substrate includes rolling a Ni or Ni-alloy rod with a rectangular section; and thermally treating the rolled rod, the rolling step having a reduction ratio of 5 to 15% at each rolling, the rod being moved between rollers for the rolling process at a linear velocity of 100 m/min or less, the thermally treating process being conducted by heating above a recrystallization temperature with flowing an inert gas including hydrogen gas.

Abstract: For flux coating of a heat exchanger tube made of aluminum, firstly, the heat exchanger tube is dipped in a storage tank containing a mixture of binder and solvent to coat the mixture on a surface of the heat exchanger tube, thereby forming a first coating layer on the surface of the heat exchanger tube. Then, flux powder is sprayed to the surface of the heat exchanger tube on which the first coating layer is formed, thereby forming a second coating layer. After that, a thickness of the heat exchanger tube on which the second coating layer is formed is controlled. Then, the thickness-controlled heat exchanger tube is heated to 150° C. or below so as to remove the solvent from the second coating layer.

Abstract: Disclosed is a superconductor wire material that configures a conductive layer in a banded state. The superconductor wire material includes a substrate made of metal; at least one buffer layer laminated on the substrate; and a superconductive layer laminated on the buffer layer, wherein, when the superconductor wire material is banded, a banding diameter (D) of the superconductor wire material and a thickness (t) of the substrate have the following relation: {t(D+t)}<0.004. Thus, when the superconductor wire material is banded, it is possible to inhibit a crack from being generated between the buffer layer and the superconductive layer of the superconductor wire material.

Abstract: The present invention provides a genetically engineered fusion protein consisting of hEGF that is internalized inside of the cells after tracing down the cancer cells expressing hEGF receptors and human angiogenin that is cytotoxic by degrading ribonucleotide upon internalization, a process for preparing a fusion protein in a large quantity by transforming E. coli with the expression vectors containing the gene encoding the fusion protein, and pharmaceutical application of the fusion protein as an anticancer agent. All components of the fusion protein form no antibodies and exhibit no immunotoxicity since they are derived from human. Each component alone is inactive to the cancer cells, however, once they are fused together, they kill the cancer cells selectively with a difference of 1000 fold in IC50 in spite of its low molecular weight. Therefore, the fusion protein of the present invention is capable of treating the cancer expressing hEGF receptors at high level without showing toxicity.

Abstract: The present invention relates to a topical composition containing human epidermal growth factor (hEGF) and polyoxyethylene-polyoxypropylene copolymer having a viscosity of 4-10 cps at 37° C, 60 rpm as the base for topical formulation to improve the wound healing ability of hEGF.

Abstract: The present invention relates to a recombinant expression vector containing a fusion gene which is prepared by ligating adhesion gene of H. pylori and A2 and B subunit genes of Vibrio cholerae toxin, and a process for preparing a chimeric protein employing a recombinant microorganism transformed with the said expression vector. The recombinant DNA which is designed for convenient expression and gene manipulation, may express a chimeric protein having excellent immunogenicity to H. pylori, which is stable in stomach, and penetrate mucous membrane of stomach easily, finally to stimulate production of sIgA. Accordingly, the chimeric protein expressed from the recombinant DNA may be used as an active ingredient of the diagnostic kit for H. pylori infection and preventive or therapeutic vaccine for H. pylori-associated diseases, and may be used in the production of anti-H. pylori antibody.