Abstract: A display device is disclosed that includes a substrate, a light emitting device disposed on the substrate, an encapsulation layer covering the light emitting device, a light control film disposed on the encapsulation layer and including a plurality of light control patterns, and each of the light control patterns includes a first metal pattern disposed on the encapsulation layer, a first light transmission pattern disposed on the first metal pattern, a second metal pattern disposed on the first light transmission pattern and overlapping the first metal pattern, a second light transmission pattern disposed on the second metal pattern and overlapping the first light transmission pattern, a first light blocking pattern disposed on the same layer as the first metal pattern and overlapping the first light transmission pattern, and a second light blocking pattern disposed on the same layer as the second metal pattern and overlapping the second light transmission pattern.

Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

Abstract: Embodiments provide a slurry for polishing copper, a manufacturing method of a display device which uses the slurry, and the display device. The slurry for polishing copper includes an abrasive, a catalyst including a single molecule having an iron ion, a polishing suppressant, and an oxidizing agent.

Abstract: A display device includes: a substrate; an inorganic insulating layer disposed on the substrate; a conductor disposed on the inorganic insulating layer; and an organic insulating layer disposed on the conductor, where an opening is defined through the organic insulating layer to expose a part of the upper surface of the conductor, and at least one material selected from a siloxane, a thiol, a phosphate, a disulfide including a sulfur series, and an amine is bonded on the part of the upper surface of the conductor exposed through the opening.

Abstract: A display device includes: a substrate; an inorganic insulating layer disposed on the substrate; a conductor disposed on the inorganic insulating layer; and an organic insulating layer disposed on the conductor, where an opening is defined through the organic insulating layer to expose a part of the upper surface of the conductor, and at least one material selected from a siloxane, a thiol, a phosphate, a disulfide including a sulfur series, and an amine is bonded on the part of the upper surface of the conductor exposed through the opening.

Abstract: A display device includes: a substrate; an inorganic insulating layer disposed on the substrate; a conductor disposed on the inorganic insulating layer; and an organic insulating layer disposed on the conductor, where an opening is defined through the organic insulating layer to expose a part of the upper surface of the conductor, and at least one material selected from a siloxane, a thiol, a phosphate, a disulfide including a sulfur series, and an amine is bonded on the part of the upper surface of the conductor exposed through the opening.

Abstract: A display device includes: a substrate; a first signal line and a second signal line disposed on the substrate; and an interlayer-insulating layer disposed between the first signal line and the second signal line. The interlayer-insulating layer includes a first portion and a second portion having different heights measured from a surface of the substrate along a first direction that is perpendicular to the surface of the substrate, an upper surface of the first portion of the interlayer-insulating layer is flat, a surface of the second portion of the interlayer-insulating layer is flat, a height of the first portion is lower than a height of the second portion, the interlayer-insulating layer defines a contact hole, and the contact hole is disposed in the first portion of the interlayer-insulating layer.

Abstract: A method of fabricating a display device includes: preparing a substrate including emission areas and a non-emission area between the emission areas; forming a bank on the non-emission area to a first height; forming light conversion patterns on the emission areas to a height equal to or less than the first height; polishing a surface of a light conversion layer including the bank and the light conversion patterns so that the surface of the light conversion layer is flat; and forming a filler layer on a surface of the substrate on which the light conversion layer is provided. The polishing of the light conversion layer includes planarizing the surface of the light conversion layer so that the bank and the light conversion patterns have a second height through chemical mechanical polishing utilizing a metallic slurry.

Abstract: A method of manufacturing a detection sensor is disclosed. The method includes forming a biometric information sensing layer including a transistor on a base layer, forming an initial optical pattern layer on the biometric information sensing layer, patterning the initial optical pattern layer to form a plurality of transmissive portions spaced apart from each other and having a first zeta potential, coating a light blocking material to form an initial light blocking portion that covers a side surface and an upper surface of the transmissive portions and has a second zeta potential different from the first zeta potential, and polishing the initial light blocking portion such that the upper surface of the transmissive portions is exposed to form a light blocking portion. The initial light blocking portion is polished by the abrasive, which has the first zeta potential, using a pad.

Abstract: A display device according to an embodiment includes: a substrate; a transistor that is disposed on the substrate; a light emitting diode that is disposed on the substrate, and connected to the transistor; and a passivation layer that is disposed between the transistor and the light emitting diode, wherein a surface step of the passivation layer is within a range of and including 1 nm to 30 nm.

Abstract: A method of manufacturing a cover window for a display device includes: providing a glass substrate having a bendable area and a flat area; modifying the bendable area by irradiating the glass substrate with a beam; and etching the bendable area to have a thinner thickness than the flat area. The bendable area may have a faster etch rate than the flat area due to the modifying of the bendable area.

Abstract: A substrate polishing system includes: a polishing machine and a substrate transporter. The polishing machine includes: a lower surface plate to which a substrate is mounted, and an upper surface plate which faces the lower surface plate and polishes the substrate in cooperation with the lower surface plate, the upper surface plate having a larger area than the substrate mounted on the lower surface plate. The substrate transporter is adjacent to the polishing machine and commonly transports the substrate to and from the polishing machine in a first direction, attaches the substrate to the lower surface plate before polishing thereof, and separates from the lower surface plate the substrate after polishing thereof.

Abstract: A display device includes: a substrate; an inorganic insulating layer disposed on the substrate; a conductor disposed on the inorganic insulating layer; and an organic insulating layer disposed on the conductor, where an opening is defined through the organic insulating layer to expose a part of the upper surface of the conductor, and at least one material selected from a siloxane, a thiol, a phosphate, a disulfide including a sulfur series, and an amine is bonded on the part of the upper surface of the conductor exposed through the opening.

Abstract: A display device includes a planarization layer covering transistors in a display area on a substrate, an organic light emitting diode on the planarization layer, a pad electrode in a non-display area on the substrate surrounding the display area, and a sacrificial layer remnant capping a side surface of the pad electrode.

Abstract: A display device includes a planarization layer covering transistors in a display area on a substrate, an organic light emitting diode on the planarization layer, a pad electrode in a non-display area on the substrate surrounding the display area, and a sacrificial layer remnant capping a side surface of the pad electrode.

Abstract: A thin-film transistor (TFT) array substrate is provided. The TFT array substrate includes a base substrate, a semiconductor layer disposed on the base substrate, an insulating layer disposed on the semiconductor layer, and a gate electrode disposed on the insulating layer. A top surface of a portion of the insulating layer overlapping the semiconductor layer in a plan view of the base substrate and a top surface of the gate electrode are placed on the same level.

Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

Abstract: A polishing slurry is disclosed which includes about 0.01 wt % to about 10 wt % of polishing particles, about 0.005 wt % to about 0.1 wt % of a dispersing agent, about 0.001 wt % to about 1 wt % of an oxide-polishing promoter including a pyridine compound, about 0.05 wt % to about 0.1 wt % of a nitride-polishing inhibitor including an amino acid or an anionic organic acid, and water. A method for manufacturing a display device including an active pattern disposed on a base substrate, a gate metal pattern including a gate electrode overlapping the active pattern, a planarized insulation layer disposed on the gate metal pattern, and a source metal pattern disposed on the planarized insulation layer is also disclosed.

Abstract: In a method of manufacturing a display device, the method includes: forming a conductive layer on a base; forming an organic layer, with a hole partially exposing the conductive layer, on the conductive layer; polishing an upper surface of the organic layer; and forming a light emitting element on the polished organic layer.

Abstract: A method of manufacturing a display and a chemical mechanical polishing method which employ a chemical mechanical polishing apparatus that includes a conveyor belt to transfer a substrate, a polishing head disposed on the conveyor belt, and a body part which moves the polishing head and supplies a slurry to the polishing head. The polishing head includes a first polishing part including a first polishing pad surrounding a first slurry outlet, and a second polishing part surrounding the first polishing part and including a second polishing pad. A second slurry outlet is formed between the first polishing part and the second polishing part, and the first polishing part and the second polishing part are movable independently of each other in a direction substantially perpendicular to the substrate.