Patents by Inventor Byoungsu KO

Byoungsu KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SECURITY CODE
    Publication number: 20230281416
    Abstract: Provided is a security code. The security code including a first region and a second region includes a metal layer, a first dielectric pattern provided on the metal layer in the first region, a polymer pattern provided on the metal layer in the second region, a first metal pattern provided on the dielectric pattern, and a second metal pattern provided on the polymer pattern, wherein the polymer pattern includes a material different from that of the first dielectric pattern, and a thickness of the polymer pattern is different from a thickness of the first dielectric pattern.
    Type: Application
    Filed: February 21, 2023
    Publication date: September 7, 2023
    Applicants: Electronics and Telecommunications Research Institute, Postech Research and Business Development Foundation
    Inventors: Soo-Jung KIM, Junsuk RHO, Sung-Hoon HONG, Byoungsu KO, Doa KIM, Jaehyuck JANG, Chunghwan JUNG