Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.

Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.

Abstract: An electrode assembly, a battery, a battery pack and a vehicle including the same are provided. In the electrode assembly, the uncoated portion of an electrode includes a segment region divided into a plurality of segments, and the segment region includes a plurality of segment groups separated by a group separation pitch along a winding direction. One end of the electrode assembly includes a plurality of segment alignments. In winding turns corresponding to the plurality of segment alignments, group separation pitches of segment groups disposed in a same winding turn are substantially identical, and separation pitches of the segment groups is greater in a winding turn of a region adjacent to the outer circumference of the electrode assembly than in a winding turn of a region adjacent to the core of the electrode assembly.

Abstract: A lighting device includes a light guide plate configured to guide and diffuse a light from a light source, and a garnish body including a lighting area to which the diffused light is radiated, wherein the light guide plate is disposed at a predetermined angle with respect to the garnish body.

Abstract: A light emitting diode package includes a housing including a body part, a first lead, a second lead, a light emitting diode chip, and a Zener diode. The body part has a cavity that is open at the top and has inclined side surfaces. The first lead and the second lead are supported by the housing and are disposed apart from each other so as to be electrically insulated. The light emitting diode chip is electrically connected to the first lead and the second lead and mounted within the cavity of the body part. The Zener diode is mounted on one side of the light emitting diode chip and inside the cavity of the body part.

Abstract: The present invention provides a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is disposed, and a package body having a cavity and supporting the lead frame. The chip area is exposed through the cavity. The lead frame includes a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area. The second terminal of the first terminal group is exposed through the cavity, and the second terminal of the second terminal group is buried in the package body.

Abstract: The present invention provides a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is disposed, and a package body having a cavity and supporting the lead frame. The chip area is exposed through the cavity. The lead frame includes a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area. The second terminal of the first terminal group is exposed through the cavity, and the second terminal of the second terminal group is buried in the package body.

Abstract: Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area, and the width of the first terminal is different than the width of the second terminal outside the package body.

Abstract: Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.

Abstract: Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.

Abstract: Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area, and the width of the first terminal is different than the width of the second terminal outside the package body.

Abstract: A synchronous transfer mode (STM)-256 adder/dropper which provides a communication path between STM-64 optical channels in an apparatus of multiplexing STM-64 optical channels into STM-256 electrical signals, is provided. The STM-256 adder/dropper transmits STM signals by multiplexing the STM signals at a low speed and simultaneously provides a communication path between lower channels.

Abstract: Disclosed is a multiwavelength locking method and apparatus using an acousto-optic tunable filter in an optical communication system including optical transport networks, in which output wavelengths of light sources are monitored under the condition in which pilot signals are applied to the acousto-optic tunable filter, so as to lock the wavelengths of the light sources, thereby eliminating an wavelength instability of the light sources for an improvement in transmission characteristics. The acousto-optic tunable filter receives light beams of N different frequencies respectively outputted from N light sources, along with N pilot signals having different frequencies, and converts respective frequencies of beam components of the output beam corresponding to the N pilot signals, thereby outputting N frequency-converted output beams to be applied to a photo-detector.

Abstract: A synchronous transfer mode (STM)-256 adder/dropper which provides a communication path between STM-64 optical channels in an apparatus of multiplexing STM-64 optical channels into STM-256 electrical signals, is provided. The STM-256 adder/dropper transmits STM signals by multiplexing the STM signals at a low speed and simultaneously provides a communication path between lower channels.

Abstract: Disclosed is a multiwavelength locking method and apparatus using an acousto-optic tunable filter in an optical communication system including optical transport networks, in which output wavelengths of light sources are monitored under the condition in which pilot signals are applied to the acousto-optic tunable filter, so as to lock the wavelengths of the light sources, thereby eliminating an wavelength instability of the light sources for an improvement in transmission characteristics. The acousto-optic tunable filter receives light beams of N different frequencies respectively outputted from N light sources, along with N pilot signals having different frequencies, and converts respective frequencies of beam components of the output beam corresponding to the N pilot signals, thereby outputting N frequency-converted output beams to be applied to a photo-detector.